Inventor · disambiguated record
Atsutoshi Inokuchi
Also filed as: INOKUCHI ATSUTOSHI
7 granted patents·4 pending applications·11 citations·filing 2007–2021
76Inventor score
Top patents by PatentIndex Score
11 records- 0177US8915999B2Shower plate sintered integrally with gas release hole member and method for manufacturing the sameOKESAKU MASAHIRO·Filed 2007·Granted Dec 23, 2014·4 cites·5 claims
- 0273US8592810B2Thin film, method of forming the same, and semiconductor light-emitting element comprising the thin filmOHMI TADAHIRO·Filed 2010·Granted Nov 26, 2013·3 cites·13 claims
- 0367US8188468B2Compound-type thin film, method of forming the same, and electronic device using the sameOHMI TADAHIRO·Filed 2008·Granted May 29, 2012·3 cites·34 claims
- 0461US7923819B2Interlayer insulating film, wiring structure and electronic device and methods of manufacturing the sameUNIV TOHOKU NAT UNIV CORP·Filed 2007·Granted Apr 12, 2011·1 cites·16 claims
- 0560US9767994B2Shower plate sintered integrally with gas release hole member and method for manufacturing the sameTOKYO ELECTRON LTD·Filed 2014·Granted Sep 19, 2017·0 cites·10 claims
- 0650US2011215384A1Semiconductor device and method of manufacturing the sameUNIV TOHOKU NAT UNIV CORP·Filed 2008·Application pending·0 cites
- 0749US2023386787A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 0847US11495439B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Nov 8, 2022·0 cites·13 claims
- 0945US2010101834A1Interlayer insulation film, interconnect structure, and methods of manufacturing themUNIV TOHOKU NAT UNIV CORP·Filed 2008·Application pending·0 cites
- 1044US2011127075A1Interlayer insulating film, wiring structure, and methods of manufacturing the sameUNIV TOHOKU NAT UNIV CORP·Filed 2008·Application pending·0 cites
- 1140US9378942B2Deposition method and deposition apparatusTOKYO ELECTRON LTD·Filed 2013·Granted Jun 28, 2016·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →