Inventor · disambiguated record
Laxmisha M. Sridhar
Also filed as: SRIDHAR LAXMISHA · SRIDHAR LAXMISHA M
11 granted patents·9 pending applications·45 citations·filing 2007–2023
84Inventor score
Files withHenkel IP & Holding GmbH11HENKEL AG & CO KGAA4HERR DONALD1Henkel IP & Holging GmbH1LIU YUXIA1
Top patents by PatentIndex Score
20 records- 0193US8734939B2Thermally reversible hot melt adhesive composition containing multifunctional diene and dienophile compoundsHERR DONALD·Filed 2011·Granted May 27, 2014·31 cites·20 claims
- 0290US8580891B2Silicone acrylic hybrid polymer-based adhesivesLIU YUXIA·Filed 2011·Granted Nov 12, 2013·9 cites·18 claims
- 0378US9938437B2Diene/dienophile couples and thermosetting resin compositions having reworkabilityHenkel IP & Holding GmbH·Filed 2015·Granted Apr 10, 2018·4 cites·10 claims
- 0466US2024084178A1Two-part, cyanoacrylate/free radically curable adhesive systemsHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 0563US10472548B2Diene/dienophile couples and thermosetting resin compositions having reworkabilityHenkel IP & Holding GmbH·Filed 2017·Granted Nov 12, 2019·1 cites·8 claims
- 0662US11542268B2Cationically curable compositions with latent reducing agent demonstrating low cure temperatureHENKEL AG & CO KGAA·Filed 2020·Granted Jan 3, 2023·0 cites·13 claims
- 0761US11078313B2Olefin-acrylate copolymers with pendant hydroxyl functionality and use thereofHenkel IP & Holding GmbH·Filed 2018·Granted Aug 3, 2021·0 cites·16 claims
- 0861US2023114308A1Flux-Compatible Epoxy-Anhydride Adhesives Compositions for Low-Gap Underfill ApplicationsHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 0957US2021253859A1Dual Curable Silicone-Organic Hybrid Polymer Compositions for Liquid Optically Clear Adhesive ApplicationsHenkel IP & Holding GmbH·Filed 2021·Application pending·0 cites
- 1053US10703836B2Synthesis of functionalized polyisobutylenesHenkel IP & Holding GmbH·Filed 2018·Granted Jul 7, 2020·0 cites·14 claims
- 1153US2024010890A1Flux-compatible epoxy-phenolic adhesive compositions for low gap underfill applicationsHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 1251US2018355231A1Debondable adhesives and the high temperature use thereofHenkel IP & Holding GmbH·Filed 2018·Application pending·0 cites
- 1350US2018134839A1Monomeric and oligomeric resins for one drop fill sealant applicationHenkel IP & Holding GmbH·Filed 2018·Application pending·0 cites
- 1448US9790309B2Grafted telechelic polyisobutylenes possessing reactive functionality, processes for preparing the same and curable compositions comprising the sameHenkel IP & Holding GmbH·Filed 2014·Granted Oct 17, 2017·0 cites·21 claims
- 1547US2010121022A11,3-dipolar cycloaddition of azides to alkynesMUSA OSAMA M·Filed 2007·Application pending·0 cites
- 1645US8324319B2Redox-induced cationically polymerizable compositions with low cure temperatureSRIDHAR LAXMISHA M·Filed 2010·Granted Dec 4, 2012·0 cites·8 claims
- 1745US2018136499A1Curable compositions for one drop fill sealant applicationHenkel IP & Holding GmbH·Filed 2018·Application pending·0 cites
- 1845US2018134657A1Bismaleimide resins for one drop fill sealant applicationHenkel IP & Holging GmbH·Filed 2018·Application pending·0 cites
- 1944US10526426B2Photoinitiators that are polymeric or polymerizable for use in UV curable pressure sensitive adhesivesHenkel IP & Holding GmbH·Filed 2017·Granted Jan 7, 2020·0 cites·8 claims
- 2038US9587054B2High molecular weight polymers having high olefin contentHenkel IP & Holding GmbH·Filed 2016·Granted Mar 7, 2017·0 cites·30 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →