Inventor · disambiguated record
Shi-Baek Nam
Also filed as: NAM SHI-BAEK
7 granted patents·2 pending applications·597 citations·filing 1997–2007
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0195US7315077B2Molded leadless package having a partially exposed lead frame padFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2004·Granted Jan 1, 2008·107 cites·27 claims
- 0293US7199461B2Semiconductor package suitable for high voltage applicationsFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2004·Granted Apr 3, 2007·78 cites·21 claims
- 0393US6621152B2Thin, small-sized power semiconductor packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2001·Granted Sep 16, 2003·91 cites·34 claims
- 0490US6756689B2Power device having multi-chip package structureFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2003·Granted Jun 29, 2004·123 cites·19 claims
- 0587US6742561B2Apparatus for die bondingSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jun 1, 2004·48 cites·8 claims
- 0686US5965947AStructure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beadsSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Oct 12, 1999·95 cites·15 claims
- 0777US6025651ASemiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound padsSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 15, 2000·55 cites·5 claims
- 0848US2007181984A1Semiconductor package suitable for high voltage applicationsFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2007·Application pending·0 cites
- 0934US2001045634A1Semiconductor packageFiled 2001·Application pending·0 cites
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