Inventor · disambiguated record
Robert Charles Dry
Also filed as: DRY ROBERT C · DRY ROBERT CHARLES
14 granted patents·2 pending applications·14 citations·filing 2015–2024
86Inventor score
Top patents by PatentIndex Score
16 records- 0186US9536803B2Integrated power module with improved isolation and thermal conductivityRF MICRO DEVICES INC·Filed 2015·Granted Jan 3, 2017·6 cites·20 claims
- 0284US11637050B2Package architecture utilizing wafer to wafer bondingQORVO US INC·Filed 2021·Granted Apr 25, 2023·1 cites·20 claims
- 0380US11114363B2Electronic package arrangements and related methodsQORVO US INC·Filed 2019·Granted Sep 7, 2021·3 cites·23 claims
- 0479US2024379487A1Package architecture utilizing wafer to wafer bondingQORVO US INC·Filed 2024·Application pending·0 cites
- 0578US10832984B2Environmental protection for wafer level and package level applicationsQORVO US INC·Filed 2020·Granted Nov 10, 2020·1 cites·8 claims
- 0677US12087656B2Package architecture utilizing wafer to wafer bondingQORVO US INC·Filed 2023·Granted Sep 10, 2024·0 cites·23 claims
- 0770US10651103B2Environmental protection for wafer level and package level applicationsQORVO US INC·Filed 2017·Granted May 12, 2020·1 cites·19 claims
- 0865US10199313B2Ring-frame power packageQORVO US INC·Filed 2017·Granted Feb 5, 2019·1 cites·18 claims
- 0959US9666498B2Ring-frame power packageRF MICRO DEVICES INC·Filed 2015·Granted May 30, 2017·1 cites·18 claims
- 1058US11244884B2Semiconductor package with floating heat spreader and process for making the sameQORVO US INC·Filed 2020·Granted Feb 8, 2022·0 cites·15 claims
- 1153US11348798B2Methods of forming integrated circuit devices using cutting tools to expose metallization pads through a cap structure and related cutting devicesAKOUSTIS INC·Filed 2020·Granted May 31, 2022·0 cites·21 claims
- 1253US10734301B2Semiconductor package with floating heat spreader and process for making the sameQORVO US INC·Filed 2019·Granted Aug 4, 2020·0 cites·16 claims
- 1353US2024258991A1Methods of packaging acoustic wave resonator devices on wafers and related wafers and structuresAKOUSTIS INC·Filed 2023·Application pending·0 cites
- 1450US10855240B2Structures for spatial power-combining devicesQORVO US INC·Filed 2018·Granted Dec 1, 2020·0 cites·22 claims
- 1540US10872837B2Air-cavity semiconductor package with low cost high thermal carrierQORVO US INC·Filed 2019·Granted Dec 22, 2020·0 cites·21 claims
- 1635US10008473B2Power package lidTRIQUINT SEMICONDUCTOR INC·Filed 2016·Granted Jun 26, 2018·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →