Inventor · disambiguated record
Suguru Ozawa
Also filed as: OZAWA SUGURU
15 granted patents·11 pending applications·27 citations·filing 2002–2023
88Inventor score
Top patents by PatentIndex Score
26 records- 0190US11352274B2Gas dissolution supply apparatus and gas dissolution supply methodEBARA CORP·Filed 2020·Granted Jun 7, 2022·2 cites·6 claims
- 0286US12263452B2Gas solution supply deviceEBARA CORP·Filed 2021·Granted Apr 1, 2025·1 cites·5 claims
- 0385US10950779B2Piezoelectric element and device using sameTEIJIN LTD·Filed 2016·Granted Mar 16, 2021·4 cites·13 claims
- 0483US11001707B2Polylactic acid composition, formed article obtained from polylactic acid composition, and method for producing polylactic acid compositionTEIJIN LTD·Filed 2015·Granted May 11, 2021·2 cites·20 claims
- 0573US8674368B2Display device and method for manufacturing thereofTAKAHASHI KEI·Filed 2012·Granted Mar 18, 2014·3 cites·13 claims
- 0672US8148236B2Display device and method for manufacturing thereofTAKAHASHI KEI·Filed 2008·Granted Apr 3, 2012·4 cites·10 claims
- 0767US11319404B2Epoxy compound, epoxy resin, epoxy resin composition, cured resin product, prepreg, fiber-reinforced composite material, and production methods for theseTEIJIN LTD·Filed 2019·Granted May 3, 2022·0 cites·13 claims
- 0865US6921063B2Gas dissolved water producing apparatus and method thereof and ultrasonic cleaning equipment and method thereofEBARA CORP·Filed 2002·Granted Jul 26, 2005·10 cites·14 claims
- 0963US2025171582A1Curing agent composition for thermosetting resin, epoxy resin composition, and fiber-reinforced composite materialTEIJIN LTD·Filed 2022·Application pending·0 cites
- 1062US2024336751A1Fiber-reinforced composite material and production method thereforTEIJIN LTD·Filed 2022·Application pending·0 cites
- 1161US2024141096A1Curing agent composition for thermosetting resin, epoxy resin composition, and fiber-reinforced composite materialTEIJIN LTD·Filed 2022·Application pending·0 cites
- 1260US11584669B2Gas-dissolved liquid manufacturing deviceEBARA CORP·Filed 2020·Granted Feb 21, 2023·0 cites·11 claims
- 1359US10654017B2Supply-liquid producing apparatus and supply-liquid producing methodEBARA CORP·Filed 2017·Granted May 19, 2020·1 cites·12 claims
- 1458US2024075410A1Gas solution supply apparatusEBARA CORP·Filed 2023·Application pending·0 cites
- 1556US11648515B2Gas solution manufacturing deviceEBARA CORP·Filed 2021·Granted May 16, 2023·0 cites·8 claims
- 1653US2020407548A1Epoxy resin composition, prepreg, fiber reinforced composite material, and production methods thereforTEIJIN LTD·Filed 2019·Application pending·0 cites
- 1747US2022332939A1Epoxy resin composition, resin cured product, fiber-reinforced composite material, and production methods thereforTEIJIN LTD·Filed 2019·Application pending·0 cites
- 1847US2009139541A1Gas dissolved water producing apparatus and method thereof and ultrasonic cleaning equipment and method thereofOZAWA SUGURU·Filed 2008·Application pending·0 cites
- 1947US2014152878A1Solid-state imaging devicePANASONIC CORP·Filed 2014·Application pending·0 cites
- 2044US10835876B2Gas-dissolved liquid producing apparatusEBARA CORP·Filed 2018·Granted Nov 17, 2020·0 cites·7 claims
- 2144US8030193B2Method of fabricating semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2007·Granted Oct 4, 2011·0 cites·12 claims
- 2244US2005150515A1Gas dissolved water producing apparatus and method thereof and ultrasonic cleaning equipment and method thereofFiled 2005·Application pending·0 cites
- 2340US8815657B2Method of manufacturing semiconductor deviceOZAWA SUGURU·Filed 2009·Granted Aug 26, 2014·0 cites·22 claims
- 2437US2017200623A1Cleaning apparatusEBARA CORP·Filed 2016·Application pending·0 cites
- 2534US2017282132A1Gas-dissolved water production device and production methodEBARA CORP·Filed 2015·Application pending·0 cites
- 2631US11101425B2Braided piezoelectric element, fabric-like piezoelectric element using braided piezoelectric element, and device using sameTEIJIN LTD·Filed 2016·Granted Aug 24, 2021·0 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →