Inventor · disambiguated record
Byoung-Rim Seo
Also filed as: SEO BYOUNG-RIM
10 granted patents·1 pending application·68 citations·filing 2005–2015
87Inventor score
Top patents by PatentIndex Score
11 records- 0186US8139145B2Camera moduleRYU HAN-SUNG·Filed 2008·Granted Mar 20, 2012·14 cites·17 claims
- 0284US7863702B2Image sensor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 4, 2011·16 cites·24 claims
- 0382US7494292B2Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structureSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 24, 2009·15 cites·37 claims
- 0480US9793309B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 17, 2017·5 cites·18 claims
- 0577US7484901B2Image sensor camera module and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 3, 2009·8 cites·15 claims
- 0676US8902356B2Image sensor module having image sensor packageSEO BYOUNG-RIM·Filed 2011·Granted Dec 2, 2014·7 cites·17 claims
- 0769US8981514B2Semiconductor package having a blocking pattern between a light transmissive cover and a substrate, and method for fabricating the sameRYU HAN-SUNG·Filed 2012·Granted Mar 17, 2015·3 cites·19 claims
- 0854US8927316B2Camera module and method of manufacturing the camera moduleSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 6, 2015·0 cites·6 claims
- 0942US8547471B2Camera module and method of manufacturing the camera moduleCHO YONG-HOE·Filed 2011·Granted Oct 1, 2013·0 cites·14 claims
- 1039US2005258502A1Chip package, image sensor module including chip package, and manufacturing method thereofKONG YUNG-CHEOL·Filed 2005·Application pending·0 cites
- 1136US9837361B2Semiconductor package with electromagnetic shielding memberSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 5, 2017·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →