Inventor · disambiguated record
Takanori Okita
Also filed as: OKITA TAKANORI
4 granted patents·4 pending applications·14 citations·filing 2003–2016
65Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0179US8569163B2Ultrasonic wire bonding method for a semiconductor deviceSEKIHARA MASAHIKO·Filed 2011·Granted Oct 29, 2013·12 cites·23 claims
- 0259US7627241B2Image pick-up inspection equipment and methodRENESAS TECH CORP·Filed 2005·Granted Dec 1, 2009·2 cites·11 claims
- 0345US10037966B2Semiconductor device and manufacturing method thereforRENESAS ELECTRONICS CORP·Filed 2016·Granted Jul 31, 2018·0 cites·6 claims
- 0441US2012098126A1Semiconductor device and manufacturing method thereforIWASAKI TOSHIHIRO·Filed 2011·Application pending·0 cites
- 0540US2009127315A1Apparatus and method for manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2008·Application pending·0 cites
- 0635US8975119B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Mar 10, 2015·0 cites·13 claims
- 0735US2004121513A1Die bonding apparatus and method of die bonding with the apparatusRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 0831US2005194423A1Ultrasonic bonding apparatus and methodRENESAS TECH CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →