Inventor · disambiguated record
Yutaka Hisaeda
Also filed as: HISAEDA YUTAKA
12 granted patents·4 pending applications·28 citations·filing 2007–2015
87Inventor score
Files withDOWA ELECTRONICS MATERIALS CO LTD4ENDOH KEIICHI3HISAEDA YUTAKA3SATO KIMITAKA3KANEDA SHUJI1
Top patents by PatentIndex Score
16 records- 0188US8293142B2Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particlesHISAEDA YUTAKA·Filed 2011·Granted Oct 23, 2012·7 cites·5 claims
- 0282US8641929B2Low-temperature-sinterable bonding material, and bonding method using the bonding materialENDOH KEIICHI·Filed 2011·Granted Feb 4, 2014·9 cites·8 claims
- 0381US8486310B2Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particlesHISAEDA YUTAKA·Filed 2011·Granted Jul 16, 2013·3 cites·8 claims
- 0475US8293144B2Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particlesHISAEDA YUTAKA·Filed 2008·Granted Oct 23, 2012·3 cites·24 claims
- 0567US8287771B2Method for producing silver particle powderSATO KIMITAKA·Filed 2007·Granted Oct 16, 2012·3 cites·6 claims
- 0660US9240256B2Bonding material and bonding method using the sameENDOH KEIICHI·Filed 2010·Granted Jan 19, 2016·1 cites·4 claims
- 0758US2012045573A1Silver conductive film and production method thereofSATO KIMITAKA·Filed 2011·Application pending·0 cites
- 0855US8858700B2Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding methodENDOH KEIICHI·Filed 2009·Granted Oct 14, 2014·1 cites·7 claims
- 0953US9721694B2Fine silver particle powder, method for manufacturing the same, silver paste using the powder and method of use of the pasteDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Aug 1, 2017·0 cites·6 claims
- 1052US9034214B2Fine silver particle powder, method for manufacturing the same, silver paste using the powder, and method of use of the pasteKANEDA SHUJI·Filed 2009·Granted May 19, 2015·1 cites·10 claims
- 1150US10008471B2Bonding material and bonding method using the sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Jun 26, 2018·0 cites·2 claims
- 1250US2009053469A1Silver Conductive Film and Production Method ThereofSATO KIMITAKA·Filed 2007·Application pending·0 cites
- 1349US10090275B2Bonding method using bonding materialDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Oct 2, 2018·0 cites·8 claims
- 1445US2011155968A1Fine metal particle-containing composition and method for manufacturing the sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2008·Application pending·0 cites
- 1544US2010025639A1Silver particle composite powder and process production thereofOGI KOZO·Filed 2007·Application pending·0 cites
- 1633US9486879B2Bonding material and bonding body, and bonding methodKURITA SATORU·Filed 2011·Granted Nov 8, 2016·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →