Inventor · disambiguated record
Ja-Bu Koo
Also filed as: KOO JA B · KOO JA-BU
6 granted patents·2 pending applications·22 citations·filing 2006–2012
76Inventor score
Top patents by PatentIndex Score
8 records- 0181US8102219B2Electromagnetic bandgap structure and printed circuit boardKOO JA-BU·Filed 2009·Granted Jan 24, 2012·12 cites·6 claims
- 0271US8153907B2Electromagnetic bandgap structure and printed circuit boardPARK DAE-HYUN·Filed 2008·Granted Apr 10, 2012·6 cites·6 claims
- 0369US8081052B2Electromagnetic bandgap structure and printed circuit boardKIM HAN·Filed 2008·Granted Dec 20, 2011·4 cites·9 claims
- 0452US8853560B2Electromagnetic bandgap structure and printed circuit boardPARK DAE-HYUN·Filed 2012·Granted Oct 7, 2014·0 cites·9 claims
- 0550US8289099B2Electromagnetic bandgap structure and circuit boardKIM HAN·Filed 2009·Granted Oct 16, 2012·0 cites·18 claims
- 0647US2009071603A1Method of manufacturing printed circuit board and electromagnetic bandgap structureSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0746US8077000B2Electromagnetic bandgap structure and printed circuit boardKOO JA-BU·Filed 2008·Granted Dec 13, 2011·0 cites·15 claims
- 0837US2007002545A1Semiconductor package board having dummy area with copper patternSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →