Inventor · disambiguated record
Jim Huang
Also filed as: HUANG JIM · HUANG JIM CY
5 granted patents·2 pending applications·165 citations·filing 2005–2019
79Inventor score
Files withTAIWAN SEMICONDUCTOR MFG4HEWLETT PACKARD ENTPR DEV LP1HEWLETT PACKARD ENTPR DEVELOPMEN LP1LIANG MONG S1
Top patents by PatentIndex Score
7 records- 0197US8048810B2Method for metal gate N/P patterningTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Nov 1, 2011·137 cites·20 claims
- 0291US7579248B2Resolving pattern-loading issues of SiGe stressorTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Aug 25, 2009·22 cites·23 claims
- 0377US10243662B2Bias-based Mach-Zehnder modulation (MZM) systemsHEWLETT PACKARD ENTPR DEVELOPMEN LP·Filed 2015·Granted Mar 26, 2019·2 cites·18 claims
- 0468US10651942B2Bias-based Mach-Zehnder modulation (MZM) systemsHEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted May 12, 2020·0 cites·18 claims
- 0555US7834389B2Triangular space element for semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 16, 2010·4 cites·20 claims
- 0643US2008138983A1Method of forming tensile stress films for NFET performance enhancementTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 0741US2007013070A1Semiconductor devices and methods of manufacture thereofLIANG MONG S·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →