Inventor · disambiguated record
Joep Stokkermans
Also filed as: STOKKERMANS JOEP
6 granted patents·6 pending applications·31 citations·filing 2003–2023
77Inventor score
Top patents by PatentIndex Score
12 records- 0185US7677523B2Gravity compensation device for a chip transfer apparatusNXP BV·Filed 2005·Granted Mar 16, 2010·16 cites·18 claims
- 0261US10998804B2Device, apparatus and systemNexperia BV·Filed 2019·Granted May 4, 2021·1 cites·18 claims
- 0353US12394747B2Curved wafer stageNexperia BV·Filed 2023·Granted Aug 19, 2025·0 cites·17 claims
- 0452US7726011B2Chip transfer method and apparatusNXP BV·Filed 2003·Granted Jun 1, 2010·7 cites·22 claims
- 0552US7578425B2Wirebonding method and apparatusNXP BV·Filed 2003·Granted Aug 25, 2009·7 cites·6 claims
- 0648US2023230892A1Chip-scale packageNexperia BV·Filed 2023·Application pending·0 cites
- 0747US2023260819A1Film frame carrier for a curved wafer stageNexperia BV·Filed 2023·Application pending·0 cites
- 0846US2023402302A1Electronic component transfer by levitationNexperia BV·Filed 2023·Application pending·0 cites
- 0944US2023402308A1Transfer device for transferring an electronic componentNexperia BV·Filed 2023·Application pending·0 cites
- 1041US2022020679A1Semiconductor device and a method of manufactureNexperia BV·Filed 2021·Application pending·0 cites
- 1141US2022020670A1Semiconductor device and a method of manufactureNexperia BV·Filed 2021·Application pending·0 cites
- 1239US8474680B2Wirebonding method and apparatusKAMPSCHREUR THOMAS M·Filed 2009·Granted Jul 2, 2013·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →