Inventor · disambiguated record
Masahisa Ikeya
Also filed as: IKEYA MASAHISA
8 granted patents·76 citations·filing 1994–2003
86Inventor score
Files withOKI ELECTRIC IND CO LTD8
Top patents by PatentIndex Score
8 records- 0166US5994716AIntegrated circuit and fabricating method and evaluating method of integrated circuitOKI ELECTRIC IND CO LTD·Filed 1997·Granted Nov 30, 1999·27 cites·8 claims
- 0261US6440846B1Method for forming semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2000·Granted Aug 27, 2002·9 cites·16 claims
- 0360US6423559B2Integrated circuit and fabricating method and evaluating method of integrated circuitOKI ELECTRIC IND CO LTD·Filed 2000·Granted Jul 23, 2002·8 cites·20 claims
- 0458US6919541B2Apparatus for preventing rapid temperature variation during wafer processingOKI ELECTRIC IND CO LTD·Filed 2002·Granted Jul 19, 2005·6 cites·6 claims
- 0550US6251696B1Method of forming integrated circuit with evaluation contacts electrically connected by forming via holes through the chip, and bonding the chip with a substrateOKI ELECTRIC IND CO LTD·Filed 1999·Granted Jun 26, 2001·13 cites·5 claims
- 0641US5412236ACompound semiconductor device and method of making itOKI ELECTRIC IND CO LTD·Filed 1994·Granted May 2, 1995·8 cites·8 claims
- 0735US6413888B1Method and apparatus for preventing rapid temperature variation of wafers during processingOKI ELECTRIC IND CO LTD·Filed 1998·Granted Jul 2, 2002·5 cites·18 claims
- 0829US6867120B2Method of fabricating a semiconductor device with a gold conductive layer and organic insulating layerOKI ELECTRIC IND CO LTD·Filed 2003·Granted Mar 15, 2005·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →