Inventor · disambiguated record
Michael Labunsky
Also filed as: LABUNSKY MICHAEL · LABUNSKY MICHAEL A
3 granted patents·1 pending application·159 citations·filing 1998–2001
77Inventor score
Files withLAM RES CORP3
Top patents by PatentIndex Score
4 records- 0188US6132289AApparatus and method for film thickness measurement integrated into a wafer load/unload unitLAM RES CORP·Filed 1998·Granted Oct 17, 2000·101 cites·18 claims
- 0277US6328637B1Method and apparatus for conditioning a polishing pad used in chemical mechanical planarizationLAM RES CORP·Filed 2000·Granted Dec 11, 2001·17 cites·20 claims
- 0373US6086460AMethod and apparatus for conditioning a polishing pad used in chemical mechanical planarizationLAM RES CORP·Filed 1998·Granted Jul 11, 2000·41 cites·30 claims
- 0431US2002137431A1Methods and apparatus for polishing and planarizationFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →