Inventor · disambiguated record
Zhiming Geng
Also filed as: GENG ZHIMING
1 granted patent·2 pending applications·1 citations·filing 2017–2022
15Inventor score
Top patents by PatentIndex Score
3 records- 0158US11049899B2Encapsulation structure of image sensing chip, and encapsulation method thereforCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Jun 29, 2021·1 cites·20 claims
- 0241US2024145114A1Method for regulating thermal boundary conductance between metal and insulatorNANJING UNIVERSITY OF TECHNOLOGY·Filed 2022·Application pending·0 cites
- 0330US2019259634A1Packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →