Inventor · disambiguated record
Won-Gil Han
Also filed as: HAN WON SEOK · HAN WON-GIL
11 granted patents·4 pending applications·25 citations·filing 2003–2020
85Inventor score
Top patents by PatentIndex Score
15 records- 0183US10784244B2Semiconductor package including multiple semiconductor chips and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 22, 2020·5 cites·13 claims
- 0283US10147706B2Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 4, 2018·4 cites·20 claims
- 0378US9252123B2Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 2, 2016·5 cites·8 claims
- 0474US8513793B2Stacked semiconductor package and method of fabricating the sameHAN WON-GIL·Filed 2011·Granted Aug 20, 2013·6 cites·20 claims
- 0570US8245902B2Wire bonding apparatus and method using the sameLEE YONG-JE·Filed 2011·Granted Aug 21, 2012·5 cites·27 claims
- 0660US11594500B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 28, 2023·0 cites·21 claims
- 0754US10679972B2Method of manufacturing multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 9, 2020·0 cites·12 claims
- 0852US10903177B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 26, 2021·0 cites·20 claims
- 0947US9384105B2Method of detecting faults of operation algorithms in a wire bonding machine and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 5, 2016·0 cites·20 claims
- 1043US10658326B2Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wireSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 19, 2020·0 cites·19 claims
- 1139US2013093080A1Multi-chip package and method of manufacturing the sameHAN WON-GIL·Filed 2012·Application pending·0 cites
- 1238US10886253B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 5, 2021·0 cites·20 claims
- 1338US2004216660A1Method of forming high-quality quantum dots by using a strained layerFiled 2003·Application pending·0 cites
- 1436US2014339290A1Wire bonding method and semiconductor package manufactured using the sameHAN WON-GIL·Filed 2014·Application pending·0 cites
- 1531US2012056178A1Multi-chip packagesHAN WON-GIL·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →