Inventor · disambiguated record
Ping-Jung Wu
Also filed as: WU PING-JUNG
13 granted patents·12 pending applications·156 citations·filing 2008–2025
89Inventor score
Top patents by PatentIndex Score
25 records- 0198US10797031B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 6, 2020·45 cites·20 claims
- 0298US10333623B1Optical transceiverTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 25, 2019·91 cites·20 claims
- 0397US11487060B2Semiconductor device with nanostructures aligned with grating coupler and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 1, 2022·5 cites·20 claims
- 0495US11774675B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·2 cites·20 claims
- 0587US10914895B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 9, 2021·5 cites·20 claims
- 0683US11830861B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 28, 2023·1 cites·20 claims
- 0781US12276838B2Semiconductor device and manufacturing method thereof having grating coupled dies and nanostructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 0880US2025216607A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0980US2025327951A1Embedded lens structures and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1079US2025364493A1Semiconductor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1179US2025357297A13dic with gap-fill structures and the method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1277US8410414B2Fluorescence microscopy imaging systemWU PING JUNG·Filed 2010·Granted Apr 2, 2013·7 cites·16 claims
- 1377US2025291091A1Embedded lens structures and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1474US2025070010A13dic with gap-fill structures and the method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1574US2023411373A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1671US2025070085A1Semiconductor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1764US12249566B13DIC with gap-fill structures and the method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 11, 2025·0 cites·20 claims
- 1862US2025349772A1Semiconductor structure, package structure and manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1954US2023201840A1Convective polymerase chain reaction apparatus and optical detecting method thereofIND TECH RES INST·Filed 2021·Application pending·0 cites
- 2053US11884912B2Cell culture device and method thereofIND TECH RES INST·Filed 2019·Granted Jan 30, 2024·0 cites·5 claims
- 2150US11358137B2Tubular structure for producing droplets and method for producing dropletsIND TECH RES INST·Filed 2019·Granted Jun 14, 2022·0 cites·20 claims
- 2250US2009161517A1Optical imaging device and optical sensor thereofIND TECH RES INST·Filed 2008·Application pending·0 cites
- 2349US10620097B2Biological sample processing deviceIND TECH RES INST·Filed 2016·Granted Apr 14, 2020·0 cites·17 claims
- 2444US9505003B2Portable real-time heating and detection deviceIND TECH RES INST·Filed 2014·Granted Nov 29, 2016·0 cites·13 claims
- 2541US2010044827A1Method for making a substrate structure comprising a film and substrate structure made by same methodKINIK CO·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →