Inventor · disambiguated record
Ryeun Kwan Kim
Also filed as: KIM RYEUN · KIM RYEUN KWAN
5 granted patents·31 citations·filing 2007–2019
74Inventor score
Technology areasH10P
Files withAPPLIED MATERIALS INC5
Top patents by PatentIndex Score
5 records- 0191US7824743B2Deposition processes for titanium nitride barrier and aluminumAPPLIED MATERIALS INC·Filed 2007·Granted Nov 2, 2010·24 cites·38 claims
- 0286US10246772B2Plasma enhanced chemical vapor deposition of films for improved vertical etch performance in 3D NAND memory devicesAPPLIED MATERIALS INC·Filed 2016·Granted Apr 2, 2019·5 cites·20 claims
- 0372US11365476B2Plasma enhanced chemical vapor deposition of films for improved vertical etch performance in 3D NAND memory devicesAPPLIED MATERIALS INC·Filed 2019·Granted Jun 21, 2022·1 cites·20 claims
- 0466US10199388B2VNAND tensile thick TEOS oxideAPPLIED MATERIALS INC·Filed 2016·Granted Feb 5, 2019·1 cites·10 claims
- 0553US10483282B2VNAND tensile thick TEOS oxideAPPLIED MATERIALS INC·Filed 2019·Granted Nov 19, 2019·0 cites·11 claims
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