Inventor · disambiguated record
Sangwhoo Lim
Also filed as: LIM SANGWHOO
10 granted patents·3 pending applications·76 citations·filing 2010–2010
89Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0192US8076182B2Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the postLIN CHARLES W C·Filed 2010·Granted Dec 13, 2011·14 cites·35 claims
- 0289US8212279B2Semiconductor chip assembly with post/base heat spreader, signal post and cavityLIN CHARLES W C·Filed 2010·Granted Jul 3, 2012·10 cites·35 claims
- 0387US8232576B1Semiconductor chip assembly with post/base heat spreader and ceramic block in postLIN CHARLES W C·Filed 2010·Granted Jul 31, 2012·10 cites·20 claims
- 0486US7939375B2Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the postBRIDGE SEMICONDUCTOR CORP·Filed 2010·Granted May 10, 2011·8 cites·35 claims
- 0585US8193556B2Semiconductor chip assembly with post/base heat spreader and cavity in postLIN CHARLES W C·Filed 2010·Granted Jun 5, 2012·7 cites·45 claims
- 0683US8415703B2Semiconductor chip assembly with post/base/flange heat spreader and cavity in flangeLIN CHARLES W C·Filed 2010·Granted Apr 9, 2013·6 cites·35 claims
- 0783US8241962B2Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavityLIN CHARLES W C·Filed 2010·Granted Aug 14, 2012·6 cites·35 claims
- 0883US8003416B2Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesivesBRIDGE SEMICONDUCTOR CORP·Filed 2010·Granted Aug 23, 2011·6 cites·35 claims
- 0981US8207553B2Semiconductor chip assembly with base heat spreader and cavity in baseLIN CHARLES W C·Filed 2010·Granted Jun 26, 2012·5 cites·35 claims
- 1077US9018667B2Semiconductor chip assembly with post/base heat spreader and dual adhesivesLIN CHARLES W C·Filed 2010·Granted Apr 28, 2015·4 cites·45 claims
- 1145US2010190300A1Method of making a semiconductor chip assembly with a base heat spreader and a cavity in the baseBRIDGE SEMICONDUCTOR CORP·Filed 2010·Application pending·0 cites
- 1245US2010181594A1Semiconductor chip assembly with post/base heat spreader and cavity over postLIN CHARLES W C·Filed 2010·Application pending·0 cites
- 1345US2011003437A1Method of making a semiconductor chip assembly with a post/base/flange heat spreader and a cavity in the flangeLIN CHARLES W C·Filed 2010·Application pending·0 cites
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