Assignee
LIN CHARLES W C
SG·42 granted patents·8 pending applications·314 citations·filing 2009–2012
Top patents by PatentIndex Score
50 records- 0198US8525214B2Semiconductor chip assembly with post/base heat spreader with thermal viaLIN CHARLES W C·Filed 2011·Granted Sep 3, 2013·56 cites·36 claims
- 0294US8865525B2Method of making cavity substrate with built-in stiffener and cavity substrate manufactured therebyLIN CHARLES W C·Filed 2012·Granted Oct 21, 2014·19 cites·20 claims
- 0394US8129742B2Semiconductor chip assembly with post/base heat spreader and plated through-holeLIN CHARLES W C·Filed 2011·Granted Mar 6, 2012·15 cites·60 claims
- 0492US8304292B1Method of making a semiconductor chip assembly with a ceramic/metal substrateLIN CHARLES W C·Filed 2010·Granted Nov 6, 2012·13 cites·20 claims
- 0592US8076182B2Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the postLIN CHARLES W C·Filed 2010·Granted Dec 13, 2011·14 cites·35 claims
- 0691US8952526B2Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitryLIN CHARLES W C·Filed 2011·Granted Feb 10, 2015·9 cites·50 claims
- 0789US8531024B2Semiconductor chip assembly with post/base heat spreader and multilevel conductive traceLIN CHARLES W C·Filed 2011·Granted Sep 10, 2013·9 cites·35 claims
- 0889US8324653B1Semiconductor chip assembly with ceramic/metal substrateLIN CHARLES W C·Filed 2010·Granted Dec 4, 2012·9 cites·20 claims
- 0989US8324723B2Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bumpLIN CHARLES W C·Filed 2010·Granted Dec 4, 2012·9 cites·65 claims
- 1089US8212279B2Semiconductor chip assembly with post/base heat spreader, signal post and cavityLIN CHARLES W C·Filed 2010·Granted Jul 3, 2012·10 cites·35 claims
- 1187US8927339B2Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitryLIN CHARLES W C·Filed 2011·Granted Jan 6, 2015·9 cites·35 claims
- 1287US8236619B2Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive traceLIN CHARLES W C·Filed 2011·Granted Aug 7, 2012·8 cites·35 claims
- 1387US8236618B2Method of making a semiconductor chip assembly with a post/base/post heat spreaderLIN CHARLES W C·Filed 2011·Granted Aug 7, 2012·8 cites·50 claims
- 1487US8232576B1Semiconductor chip assembly with post/base heat spreader and ceramic block in postLIN CHARLES W C·Filed 2010·Granted Jul 31, 2012·10 cites·20 claims
- 1586US8535985B2Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bumpLIN CHARLES W C·Filed 2011·Granted Sep 17, 2013·7 cites·32 claims
- 1685US8310043B2Semiconductor chip assembly with post/base heat spreader with ESD protection layerLIN CHARLES W C·Filed 2010·Granted Nov 13, 2012·8 cites·55 claims
- 1785US8193556B2Semiconductor chip assembly with post/base heat spreader and cavity in postLIN CHARLES W C·Filed 2010·Granted Jun 5, 2012·7 cites·45 claims
- 1885US8178395B2Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal viaLIN CHARLES W C·Filed 2011·Granted May 15, 2012·7 cites·40 claims
- 1983US8415703B2Semiconductor chip assembly with post/base/flange heat spreader and cavity in flangeLIN CHARLES W C·Filed 2010·Granted Apr 9, 2013·6 cites·35 claims
- 2083US8329510B2Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layerLIN CHARLES W C·Filed 2010·Granted Dec 11, 2012·7 cites·51 claims
- 2183US8314438B2Semiconductor chip assembly with bump/base heat spreader and cavity in bumpLIN CHARLES W C·Filed 2010·Granted Nov 20, 2012·6 cites·28 claims
- 2283US8288792B2Semiconductor chip assembly with post/base/post heat spreaderLIN CHARLES W C·Filed 2011·Granted Oct 16, 2012·6 cites·50 claims
- 2383US8241962B2Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavityLIN CHARLES W C·Filed 2010·Granted Aug 14, 2012·6 cites·35 claims
- 2483US8207019B2Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric postsLIN CHARLES W C·Filed 2011·Granted Jun 26, 2012·5 cites·53 claims
- 2582US8232573B2Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive traceLIN CHARLES W C·Filed 2010·Granted Jul 31, 2012·4 cites·35 claims
- 2681US8283211B2Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bumpLIN CHARLES W C·Filed 2010·Granted Oct 9, 2012·5 cites·15 claims
- 2781US8207553B2Semiconductor chip assembly with base heat spreader and cavity in baseLIN CHARLES W C·Filed 2010·Granted Jun 26, 2012·5 cites·35 claims
- 2881US8153477B2Method of making a semiconductor chip assembly with a post/dielectric/post heat spreaderLIN CHARLES W C·Filed 2011·Granted Apr 10, 2012·5 cites·40 claims
- 2979US8067270B2Method of making a semiconductor chip assembly with a post/base heat spreader and a substrateLIN CHARLES W C·Filed 2009·Granted Nov 29, 2011·5 cites·54 claims
- 3079US8067784B2Semiconductor chip assembly with post/base heat spreader and substrateLIN CHARLES W C·Filed 2009·Granted Nov 29, 2011·5 cites·45 claims
- 3177US9018667B2Semiconductor chip assembly with post/base heat spreader and dual adhesivesLIN CHARLES W C·Filed 2010·Granted Apr 28, 2015·4 cites·45 claims
- 3276US8841171B2Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitryLIN CHARLES W C·Filed 2011·Granted Sep 23, 2014·4 cites·44 claims
- 3373US8298868B2Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-holeLIN CHARLES W C·Filed 2011·Granted Oct 30, 2012·2 cites·25 claims
- 3473US8203167B2Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminalLIN CHARLES W C·Filed 2010·Granted Jun 19, 2012·3 cites·35 claims
- 3568US8227270B2Method of making a semiconductor chip assembly with a post/base heat spreader and an adhesive between the base and a terminalLIN CHARLES W C·Filed 2010·Granted Jul 24, 2012·2 cites·35 claims
- 3666US8614502B2Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic deviceLIN CHARLES W C·Filed 2012·Granted Dec 24, 2013·2 cites·12 claims
- 3763US8901435B2Hybrid wiring board with built-in stopper, interposer and build-up circuitryLIN CHARLES W C·Filed 2012·Granted Dec 2, 2014·1 cites·12 claims
- 3862US8110446B2Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive traceLIN CHARLES W C·Filed 2009·Granted Feb 7, 2012·2 cites·45 claims
- 3960US8269336B2Semiconductor chip assembly with post/base heat spreader and signal postLIN CHARLES W C·Filed 2009·Granted Sep 18, 2012·1 cites·60 claims
- 4059US8148747B2Semiconductor chip assembly with post/base/cap heat spreaderLIN CHARLES W C·Filed 2009·Granted Apr 3, 2012·1 cites·75 claims
- 4155US2012126399A1Thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitryLIN CHARLES W C·Filed 2011·Application pending·0 cites
- 4255US2012126401A1Stackable semiconductor assembly with bump/base/flange heat spreader and electromagnetic shieldingLIN CHARLES W C·Filed 2011·Application pending·0 cites
- 4353US8163603B2Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grindingLIN CHARLES W C·Filed 2011·Granted Apr 24, 2012·0 cites·35 claims
- 4453US8148207B2Method of making a semiconductor chip assembly with a post/base/cap heat spreaderLIN CHARLES W C·Filed 2009·Granted Apr 3, 2012·0 cites·60 claims
- 4553US2011156090A1Semiconductor chip assembly with post/base/post heat spreader and asymmetric postsLIN CHARLES W C·Filed 2011·Application pending·0 cites
- 4653US2010072511A1Semiconductor chip assembly with copper/aluminum post/base heat spreaderLIN CHARLES W C·Filed 2009·Application pending·0 cites
- 4748US2010052005A1Semiconductor chip assembly with post/base heat spreader and conductive traceLIN CHARLES W C·Filed 2009·Application pending·0 cites
- 4847US2011278638A1Semiconductor chip assembly with post/dielectric/post heat spreaderLIN CHARLES W C·Filed 2011·Application pending·0 cites
- 4945US2010181594A1Semiconductor chip assembly with post/base heat spreader and cavity over postLIN CHARLES W C·Filed 2010·Application pending·0 cites
- 5045US2011003437A1Method of making a semiconductor chip assembly with a post/base/flange heat spreader and a cavity in the flangeLIN CHARLES W C·Filed 2010·Application pending·0 cites
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