Inventor · disambiguated record
Hung-Yi Chung
Also filed as: CHUNG HUNG-YI
10 granted patents·2 pending applications·22 citations·filing 2008–2025
84Inventor score
Top patents by PatentIndex Score
12 records- 0194US11231376B2Method for semiconductor wafer inspection and system thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·3 cites·20 claims
- 0287US12068207B2Simultaneous multi-bandwidth optical inspection of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 20, 2024·1 cites·20 claims
- 0383US2025315942A1Hot spot defect detecting method and hot spot defect detecting systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0482US7672122B2Flash memory disk with rotatable and telescopic protection structure and method using the samePHISON ELECTRONICS CORP·Filed 2008·Granted Mar 2, 2010·10 cites·16 claims
- 0579US12387318B2Hot spot defect detecting method and hot spot defect detecting systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 0678US10809635B2Defect inspection method and defect inspection systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 20, 2020·2 cites·20 claims
- 0772US2024363451A1Simultaneous multi-bandwidth optical inspection of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0867US11900586B2Hot spot defect detecting method and hot spot defect detecting systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 13, 2024·0 cites·20 claims
- 0956US8120903B2Storage apparatusLIN WEI-HUNG·Filed 2008·Granted Feb 21, 2012·5 cites·17 claims
- 1054US10872406B2Hot spot defect detecting method and hot spot defect detecting systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 22, 2020·0 cites·20 claims
- 1149US8222743B2Flash memory storage apparatusLIN YU-FONG·Filed 2009·Granted Jul 17, 2012·0 cites·15 claims
- 1248US8482128B2Flash memory storage apparatusLIN YU-FONG·Filed 2012·Granted Jul 9, 2013·1 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →