Inventor · disambiguated record
Sesh Ramaswami
Also filed as: RAMASWAMI SESH
4 granted patents·2 pending applications·92 citations·filing 1998–2013
78Inventor score
Top patents by PatentIndex Score
6 records- 0187US8283237B2Fabrication of through-silicon vias on silicon wafersRAJAGOPALAN NAGARAJAN·Filed 2010·Granted Oct 9, 2012·11 cites·34 claims
- 0281US6362099B1Method for enhancing the adhesion of copper deposited by chemical vapor depositionAPPLIED MATERIALS INC·Filed 1999·Granted Mar 26, 2002·62 cites·3 claims
- 0380US8329575B2Fabrication of through-silicon vias on silicon wafersRAJAGOPALAN NAGARAJAN·Filed 2010·Granted Dec 11, 2012·6 cites·24 claims
- 0447US7294242B1Collimated and long throw magnetron sputtering of nickel/iron films for magnetic recording head applicationsAPPLIED MATERIALS INC·Filed 1998·Granted Nov 13, 2007·13 cites·39 claims
- 0540US2014273354A1Fabrication of 3d chip stacks without carrier platesAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 0634US2002119657A1Method for enhancing the adhesion of copper deposited by chemical vapor depositionFiled 2001·Application pending·0 cites
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