Inventor · disambiguated record
Chao-Kun Tseng
Also filed as: TSENG CHAO-KUN
14 granted patents·1 pending application·200 citations·filing 1998–2013
92Inventor score
Files withFOXCONN PREC COMPONENTS CO LTD5CHI MEI COMM SYSTEMS INC4HON HAI PREC IND CO LTD4CHAN KAI-PO2
Top patents by PatentIndex Score
15 records- 0193US7576291B2Key button mechanism and an electronic device using the sameCHI MEI COMM SYSTEMS INC·Filed 2008·Granted Aug 18, 2009·36 cites·18 claims
- 0290US6412546B1Heat dissipation device for integrated circuitsFOXCONN PREC COMPONENTS CO LTD·Filed 2000·Granted Jul 2, 2002·68 cites·4 claims
- 0387US9118140B2Chip card holder with protective cover for portable electronic devicesCHI MEI COMM SYSTEMS INC·Filed 2013·Granted Aug 25, 2015·15 cites·13 claims
- 0476US6728107B2Mounting assembly for heat sinkHON HAI PREC IND CO LTD·Filed 2002·Granted Apr 27, 2004·24 cites·17 claims
- 0568US6318451B1Heat sink for integrated circuitFOXCONN PREC COMPONENTS CO LTD·Filed 2000·Granted Nov 20, 2001·16 cites·1 claims
- 0667US8018527B2Connecting structure and digital camera module employing the sameCHI MEI COMM SYSTEMS INC·Filed 2008·Granted Sep 13, 2011·2 cites·16 claims
- 0758US8111855B2Microphone assembly and a portable electronic device using the microphone assemblyCHAN KAI-PO·Filed 2008·Granted Feb 7, 2012·1 cites·15 claims
- 0852US6452800B2Heat sink assembly for dissipating heat of an electronic package mounted on an electrical socketHON HAI PREC IND CO LTD·Filed 2001·Granted Sep 17, 2002·5 cites·7 claims
- 0951US6195874B1Folded fin forming method, machine and folded fin obtained therefromHON HAI PREC IND CO LTD·Filed 1998·Granted Mar 6, 2001·11 cites·13 claims
- 1047US8241784B2Cover mechanismCHAN KAI-PO·Filed 2009·Granted Aug 14, 2012·0 cites·12 claims
- 1144US6442836B1Method of making folded finFOXCONN PREC COMPONENTS CO LTD·Filed 2000·Granted Sep 3, 2002·1 cites·3 claims
- 1244US6273185B1Heat sink and retainer for electronic integrated devicesFOXCONN PREC COMPONENTS CO LTD·Filed 1999·Granted Aug 14, 2001·11 cites·3 claims
- 1339US2009291598A1Earphone jack assembly and a portable electronic device using the earphone jack assemblyCHI MEI COMM SYSTEMS INC·Filed 2008·Application pending·0 cites
- 1433US6321584B1Method and machine for making folded fins for a heat sinkHON HAI PREC IND CO LTD·Filed 1999·Granted Nov 27, 2001·5 cites·16 claims
- 1531US6317323B1Heat sink assembly for an electrical socketFOXCONN PREC COMPONENTS CO LTD·Filed 1999·Granted Nov 13, 2001·5 cites·2 claims
Join the waitlist — get patent alerts
Get an alert when Chao-Kun Tseng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →