Inventor · disambiguated record
Thomas M. Goida
Also filed as: GOIDA THOMAS · GOIDA THOMAS M
29 granted patents·6 pending applications·269 citations·filing 1986–2023
96Inventor score
Top patents by PatentIndex Score
35 records- 0192US8447057B2Packages and methods for packaging MEMS microphone devicesGOIDA THOMAS·Filed 2011·Granted May 21, 2013·34 cites·25 claims
- 0291US9343367B2Integrated device die and package with stress reduction featuresANALOG DEVICES INC·Filed 2014·Granted May 17, 2016·11 cites·20 claims
- 0391US7871865B2Stress free package and laminate-based isolator packageANALOG DEVICES INC·Filed 2007·Granted Jan 18, 2011·23 cites·17 claims
- 0488US7939916B2Wafer level CSP packaging conceptANALOG DEVICES INC·Filed 2007·Granted May 10, 2011·19 cites·8 claims
- 0587US8624380B2Vertical mount package for MEMS sensorsXUE XIAOJIE·Filed 2012·Granted Jan 7, 2014·6 cites·11 claims
- 0686US9475694B2Two-axis vertical mount package assemblyANALOG DEVICES GLOBAL·Filed 2013·Granted Oct 25, 2016·15 cites·21 claims
- 0786US9209121B2Double-sided packageANALOG DEVICES INC·Filed 2013·Granted Dec 8, 2015·8 cites·30 claims
- 0884US8946879B2Packages and methods for 3D integration including two stacked dies with a portion of one die extending into a hole of the other dieGOIDA THOMAS·Filed 2012·Granted Feb 3, 2015·7 cites·32 claims
- 0984US8723308B2Packages and methods for packaging using a lid having multiple conductive layersYANG JICHENG·Filed 2011·Granted May 13, 2014·10 cites·20 claims
- 1083US9162872B2Pre-molded MEMS device package having conductive column coupled to leadframe and coverINVENSENSE INC·Filed 2013·Granted Oct 20, 2015·4 cites·29 claims
- 1182US9698127B2Integrated device die and package with stress reduction featuresANALOG DEVICES INC·Filed 2016·Granted Jul 4, 2017·3 cites·20 claims
- 1275US10287161B2Stress isolation features for stacked diesANALOG DEVICES INC·Filed 2016·Granted May 14, 2019·3 cites·20 claims
- 1375US8174111B2Vertical mount package for MEMS sensorsXUE XIAOJIE·Filed 2009·Granted May 8, 2012·6 cites·11 claims
- 1475US5084753APackaging for multiple chips on a single leadframeANALOG DEVICES INC·Filed 1989·Granted Jan 28, 1992·55 cites·5 claims
- 1573US8941223B2MEMS device package with conductive shellINVENSENSE INC·Filed 2013·Granted Jan 27, 2015·2 cites·11 claims
- 1673USD316955SPadlockPhadz·Filed 1988·Granted May 21, 1991·22 cites·1 claims
- 1772US9142470B2Packages and methods for packagingANALOG DEVICES INC·Filed 2014·Granted Sep 22, 2015·3 cites·20 claims
- 1869US7829379B2Wafer level stacked die packagingANALOG DEVICES INC·Filed 2007·Granted Nov 9, 2010·3 cites·14 claims
- 1968US9215519B2Reduced footprint microphone system with spacer member having through-holeGOIDA THOMAS·Filed 2010·Granted Dec 15, 2015·3 cites·37 claims
- 2067US10800651B2Low stress integrated device packagesANALOG DEVICES INC·Filed 2017·Granted Oct 13, 2020·1 cites·20 claims
- 2167US9407997B2Microphone package with embedded ASICDELAUS MICHAEL D·Filed 2011·Granted Aug 2, 2016·4 cites·16 claims
- 2264US9258634B2Microphone system with offset aperturesINVENSENSE INC·Filed 2013·Granted Feb 9, 2016·1 cites·19 claims
- 2364US9079760B2Integrated microphone packageINVENSENSE INC·Filed 2013·Granted Jul 14, 2015·3 cites·18 claims
- 2462US8779535B2Packaged integrated device die between an external and internal housingGOIDA THOMAS M·Filed 2012·Granted Jul 15, 2014·2 cites·30 claims
- 2559US4700935AFixture for wave soldering packaged integrated circuitsWINSLOW RUSSELL T·Filed 1986·Granted Oct 20, 1987·21 cites·5 claims
- 2658US9260293B2Pre-molded MEMS device package with conductive shellINVENSENSE INC·Filed 2014·Granted Feb 16, 2016·0 cites·8 claims
- 2756US2024213188A1High frequency device packagesANALOG DEVICES INC·Filed 2023·Application pending·0 cites
- 2855US11702335B2Low stress integrated device packageANALOG DEVICES INC·Filed 2020·Granted Jul 18, 2023·0 cites·20 claims
- 2955US9573800B2Pre-molded MEMS device package having conductive column coupled to leadframe and coverINVENSENSE INC·Filed 2015·Granted Feb 21, 2017·0 cites·14 claims
- 3046US9533878B2Low stress compact device packagesANALOG DEVICES INC·Filed 2014·Granted Jan 3, 2017·0 cites·20 claims
- 3146US2011049712A1Wafer Level Stacked Die PackagingANALOG DEVICES INC·Filed 2010·Application pending·0 cites
- 3244US2008182434A1Low Cost Stacked PackageANALOG DEVICES INC·Filed 2007·Application pending·0 cites
- 3342US2008197514A1Die coat perimeter to enhance semiconductor reliabilityGOIDA THOMAS·Filed 2007·Application pending·0 cites
- 3440US2008087979A1Integrated Circuit with Back Side Conductive PathsANALOG DEVICES INC·Filed 2006·Application pending·0 cites
- 3535US2007111399A1Method of fabricating an exposed die packageGOIDA THOMAS M·Filed 2005·Application pending·0 cites
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