Inventor · disambiguated record
James F. Burgess
Also filed as: BURGESS JAMES F · BURGESS JAMES FLETCHER
19 granted patents·1,413 citations·filing 1975–2001
97Inventor score
Top patents by PatentIndex Score
19 records- 0197US5637922AWireless radio frequency power semiconductor devices using high density interconnectGEN ELECTRIC·Filed 1994·Granted Jun 10, 1997·272 cites·12 claims
- 0297US5532512ADirect stacked and flip chip power semiconductor device structuresGEN ELECTRIC·Filed 1994·Granted Jul 2, 1996·377 cites·22 claims
- 0393US3993411ABonds between metal and a non-metallic substrateGEN ELECTRIC·Filed 1975·Granted Nov 23, 1976·103 cites·6 claims
- 0491US4803450AMultilayer circuit board fabricated from siliconGEN ELECTRIC·Filed 1987·Granted Feb 7, 1989·73 cites·19 claims
- 0588US4996116AEnhanced direct bond structureGEN ELECTRIC·Filed 1989·Granted Feb 26, 1991·50 cites·49 claims
- 0687US4103274AReconstituted metal oxide varistorGEN ELECTRIC·Filed 1976·Granted Jul 25, 1978·29 cites·25 claims
- 0783US5103290AHermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chipGEN ELECTRIC·Filed 1989·Granted Apr 7, 1992·62 cites·42 claims
- 0883US4711804ACircuit board constructionGEN ELECTRIC·Filed 1986·Granted Dec 8, 1987·45 cites·12 claims
- 0980US5028987AHigh current hermetic package having a lead extending through the package lid and a packaged semiconductor chipGEN ELECTRIC·Filed 1989·Granted Jul 2, 1991·52 cites·25 claims
- 1079US5166773AHermetic package and packaged semiconductor chip having closely spaced leads extending through the package lidGEN ELECTRIC·Filed 1989·Granted Nov 24, 1992·50 cites·15 claims
- 1178US5100740ADirect bonded symmetric-metallic-laminate/substrate structuresGEN ELECTRIC·Filed 1991·Granted Mar 31, 1992·35 cites·25 claims
- 1275US5293070AIntegrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modulesGEN ELECTRIC·Filed 1992·Granted Mar 8, 1994·59 cites·3 claims
- 1375US5105536AMethod of packaging a semiconductor chip in a low inductance packageGEN ELECTRIC·Filed 1991·Granted Apr 21, 1992·51 cites·4 claims
- 1474US5135890AMethod of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chipGEN ELECTRIC·Filed 1991·Granted Aug 4, 1992·49 cites·6 claims
- 1572US5964418ASpray nozzle for applying metal-filled solventless resin coating and methodUSBI CO·Filed 1997·Granted Oct 12, 1999·33 cites·14 claims
- 1666US5324987AElectronic apparatus with improved thermal expansion matchGEN ELECTRIC·Filed 1993·Granted Jun 28, 1994·34 cites·20 claims
- 1756US6136379AMethod for applying metal-filled solventless resin coatingUSBI CO·Filed 1999·Granted Oct 24, 2000·20 cites·3 claims
- 1851US5209390AHermetic package and packaged semiconductor chip having closely spaced leads extending through the package lidGEN ELECTRIC·Filed 1992·Granted May 11, 1993·18 cites·5 claims
- 1939US6622739B2Method and apparatus for removal of coatings and oxidation from transit vehiclesADVANCED SYSTEMS TECHNOLOGIES·Filed 2001·Granted Sep 23, 2003·1 cites·9 claims
Join the waitlist — get patent alerts
Get an alert when James F. Burgess files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →