Inventor · disambiguated record
Po-Hao Chang
Also filed as: CHANG PO-HAO
6 granted patents·3 pending applications·9 citations·filing 2015–2023
72Inventor score
Files withMEDIATEK INC3APPLE INC2ASCLEPIUMM TAIWAN CO LTD2CHEN HUNG KAI1ELIXIRON IMMUNOTHERAPEUTICS HONG KONG LTD1
Top patents by PatentIndex Score
9 records- 0193US11646302B2Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ringAPPLE INC·Filed 2020·Granted May 9, 2023·4 cites·30 claims
- 0277US10836823B2Dsg2 monoclonal antibody and the applications thereofASCLEPIUMM TAIWAN CO LTD·Filed 2016·Granted Nov 17, 2020·5 cites·6 claims
- 0369US12249599B2Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ringAPPLE INC·Filed 2023·Granted Mar 11, 2025·0 cites·16 claims
- 0464US12334444B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2022·Granted Jun 17, 2025·0 cites·11 claims
- 0564US2024190934A1Engineered interleukin-10 and fusion proteins thereofELIXIRON IMMUNOTHERAPEUTICS HONG KONG LTD·Filed 2023·Application pending·0 cites
- 0654US11342267B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2019·Granted May 24, 2022·0 cites·5 claims
- 0754US2024408177A1Interleukin-10 muteins and fusion proteins thereofCHEN HUNG KAI·Filed 2022·Application pending·0 cites
- 0837US11458208B2Desmoglein 2 antibody fusion proteins for drug deliveryASCLEPIUMM TAIWAN CO LTD·Filed 2017·Granted Oct 4, 2022·0 cites·14 claims
- 0932US2016218092A1Chip package with embedded passive deviceMEDIATEK INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →