Inventor · disambiguated record
Haruyuki Yoshii
Also filed as: YOSHII HARUYUKI
8 granted patents·51 citations·filing 2000–2018
82Inventor score
Top patents by PatentIndex Score
8 records- 0184US6498200B1Cationically polymerizable resin compositionNAMICS CORP·Filed 2000·Granted Dec 24, 2002·31 cites·15 claims
- 0280US8586467B2Method of mounting electronic component and mounting substrateSUZUKI OSAMU·Filed 2010·Granted Nov 19, 2013·6 cites·19 claims
- 0377US9805998B2Liquid sealing material and electronic component using sameNAMICS CORP·Filed 2013·Granted Oct 31, 2017·4 cites·18 claims
- 0460US6841415B2Flip chip mounting method which avoids void formation between a semiconductor chip and a substrateNAMICS CORP·Filed 2001·Granted Jan 11, 2005·10 cites·5 claims
- 0549US9748158B2Liquid sealing material and electronic component using sameNAMICS CORP·Filed 2016·Granted Aug 29, 2017·0 cites·24 claims
- 0641US12454612B2Liquid resin composition for compression molding and electronic component apparatusHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 28, 2025·0 cites·10 claims
- 0738US12131970B2Liquid resin composition for sealing and electronic component apparatusHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 29, 2024·0 cites·20 claims
- 0832US10941280B2Liquid sealing material for copper bump, and resin composition for use as sameNAMICS CORP·Filed 2015·Granted Mar 9, 2021·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →