Inventor · disambiguated record
Jan Gulpen
Also filed as: GULPEN JAN
7 granted patents·1 pending application·13 citations·filing 2009–2018
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0182US9379071B2Single inline no-lead semiconductor packageNXP BV·Filed 2014·Granted Jun 28, 2016·7 cites·19 claims
- 0272US10109564B2Wafer level chip scale semiconductor packageNXP BV·Filed 2017·Granted Oct 23, 2018·2 cites·20 claims
- 0372US9653414B2Shielded QFN package and method of makingNXP BV·Filed 2015·Granted May 16, 2017·2 cites·14 claims
- 0460US8679963B2Fan-out chip scale packageNXP BV·Filed 2013·Granted Mar 25, 2014·2 cites·14 claims
- 0549US10096555B2Shielded QFN package and method of makingNXP BV·Filed 2017·Granted Oct 9, 2018·0 cites·19 claims
- 0643US8482136B2Fan-out chip scale packageGULPEN JAN·Filed 2009·Granted Jul 9, 2013·0 cites·23 claims
- 0737US10431476B2Method of making a plurality of packaged semiconductor devicesNXP BV·Filed 2018·Granted Oct 1, 2019·0 cites·12 claims
- 0832US2017103939A1Ultrathin routable quad flat no-leads (qfn) packageNXP BV·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →