Inventor · disambiguated record
Gongyue Tang
Also filed as: TANG GONGYUE
2 granted patents·1 pending application·2 citations·filing 2019–2021
33Inventor score
Technology areasH10W
Files withAGENCY SCIENCE TECH & RES3
Top patents by PatentIndex Score
3 records- 0170US11515237B2Plurality of heat sinks for a semiconductor packageAGENCY SCIENCE TECH & RES·Filed 2019·Granted Nov 29, 2022·2 cites·18 claims
- 0244US2023268332A1Power module package and method of forming the sameAGENCY SCIENCE TECH & RES·Filed 2021·Application pending·0 cites
- 0334US11948861B2Liquid cooling module and method of forming the sameAGENCY SCIENCE TECH & RES·Filed 2019·Granted Apr 2, 2024·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →