Inventor · disambiguated record
Peter Strobel
Also filed as: STROBEL PETER
30 granted patents·3 pending applications·212 citations·filing 2001–2024
95Inventor score
Files withINFINEON TECHNOLOGIES AG26LEICA MICROSYSTEMS SCHWEIZ AG2INFINEON TECHNOLOGIES AUSTRIA1LEICA MICROSYSTEMS NC INC1LEICA MICROSYSTEMS SWITZERLAND1
Top patents by PatentIndex Score
33 records- 0194US7943423B2Reconfigured wafer alignmentINFINEON TECHNOLOGIES AG·Filed 2009·Granted May 17, 2011·28 cites·24 claims
- 0289US7575173B2Smart card, smart card module, and a method for production of a smart card moduleINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 18, 2009·22 cites·6 claims
- 0389US7420262B2Electronic component and semiconductor wafer, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 2, 2008·52 cites·9 claims
- 0488US7276785B2Electronic module, panel having electronic modules which are to be divided up, and process for the production thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted Oct 2, 2007·68 cites·10 claims
- 0575US10396015B2Die attach methods and semiconductor devices manufactured based on such methodsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 27, 2019·2 cites·10 claims
- 0671US7379239B2Zero-degree assistant's device for a microscopeLEICA MICROSYSTEMS SCHWEIZ AG·Filed 2006·Granted May 27, 2008·7 cites·14 claims
- 0769US9673170B2Batch process for connecting chips to a carrierINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 6, 2017·2 cites·16 claims
- 0868US10832992B2Die attach methods and semiconductor devices manufactured based on such methodsINFINEON TECHNOLOGIES AG·Filed 2019·Granted Nov 10, 2020·1 cites·10 claims
- 0963US11296015B2Die attach methods and semiconductor devices manufactured based on such methodsINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 5, 2022·0 cites·19 claims
- 1063US8154795B2Stereo microscope with beam splitter deviceSCHNITZLER HARALD·Filed 2009·Granted Apr 10, 2012·6 cites·10 claims
- 1162US7547645B2Method for coating a structure comprising semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 16, 2009·2 cites·16 claims
- 1261US7470601B2Semiconductor device with semiconductor chip and adhesive film and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 30, 2008·3 cites·6 claims
- 1358US7893532B2External contact material for external contacts of a semiconductor device and method of making the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 22, 2011·1 cites·13 claims
- 1458US2025125304A1Method of manufacturing a chip structure and chip structureINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1555US7136221B2Microscope with a handle and/or hand-grip for a microscopeLEICA MICROSYSTEMS SWITZERLAND·Filed 2001·Granted Nov 14, 2006·8 cites·48 claims
- 1654US12111209B2Compact diffraction limited near infrared (NIR) spectrometers and related detectorsLEICA MICROSYSTEMS NC INC·Filed 2019·Granted Oct 8, 2024·0 cites·10 claims
- 1753US11502042B2Processing of one or more carrier bodies and electronic components by multiple alignmentINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 15, 2022·0 cites·16 claims
- 1852US11710684B2Package with separate substrate sectionsINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 25, 2023·0 cites·18 claims
- 1952US9349680B2Chip arrangement and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA·Filed 2014·Granted May 24, 2016·0 cites·19 claims
- 2051US7749864B2Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jul 6, 2010·0 cites·22 claims
- 2151US7700956B2Sensor component and panel used for the production thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 20, 2010·4 cites·8 claims
- 2250US7524699B2Electronic component and a panelINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 28, 2009·4 cites·4 claims
- 2350US7294916B2Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 13, 2007·0 cites·11 claims
- 2449US7772105B2Semiconductor component with plastic housing, and process for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 10, 2010·0 cites·8 claims
- 2548US7662664B2Electronic circuit in a package-on-package configuration and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 16, 2010·0 cites·13 claims
- 2647US7391103B2Electronic module having plug contacts and method for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 24, 2008·2 cites·21 claims
- 2746US7327023B2Semiconductor component with plastic housing, and process for producing the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 5, 2008·0 cites·12 claims
- 2845US7592236B2Method for applying a structure of joining material to the back surfaces of semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 22, 2009·0 cites·14 claims
- 2943US7443580B2Apparatus for pupil distance adjustment for eyepiecesLEICA MICROSYSTEMS SCHWEIZ AG·Filed 2006·Granted Oct 28, 2008·0 cites·6 claims
- 3041US7919857B2Plastic housing and semiconductor component with said plastic housingINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 5, 2011·0 cites·16 claims
- 3141US2010051190A1Method for applying an adhesive layer on thin cut semiconductor chips of semiconductor wafersQIMONDA AG·Filed 2005·Application pending·0 cites
- 3239US2020395334A1Method and Structure for Supporting Thin Semiconductor Chips with a Metal CarrierINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 3336US7602614B2Electronic module and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted Oct 13, 2009·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →