Inventor · disambiguated record
Rainer Steiner
Also filed as: STEINER RAINER
16 granted patents·4 pending applications·139 citations·filing 2003–2013
92Inventor score
Files withINFINEON TECHNOLOGIES AG11BARTH HANS-JOACHIM2STEINER RAINER2BAUER MICHAEL1BRUNNBAUER MARKUS1
Top patents by PatentIndex Score
20 records- 0195US8330273B2Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chipBRUNNBAUER MARKUS·Filed 2010·Granted Dec 11, 2012·25 cites·23 claims
- 0294US8148257B1Semiconductor structure and method for making sameBARTH HANS-JOACHIM·Filed 2010·Granted Apr 3, 2012·24 cites·6 claims
- 0391US7863088B2Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compoundINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 4, 2011·18 cites·18 claims
- 0479US7638418B2Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 29, 2009·8 cites·8 claims
- 0579US7319598B2Electronic component with a housing packageINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jan 15, 2008·23 cites·5 claims
- 0679US7009288B2Semiconductor component with electromagnetic shielding deviceINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 7, 2006·31 cites·16 claims
- 0770US8330274B2Semiconductor structure and method for making sameBARTH HANS-JOACHIM·Filed 2010·Granted Dec 11, 2012·2 cites·17 claims
- 0869US8659135B2Semiconductor device stack and method for its productionBAUER MICHAEL·Filed 2005·Granted Feb 25, 2014·5 cites·8 claims
- 0962US9658296B2Current sensor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 23, 2017·1 cites·24 claims
- 1062US8334202B2Device fabricated using an electroplating processPOHL JENS·Filed 2009·Granted Dec 18, 2012·2 cites·16 claims
- 1153US8786085B2Semiconductor structure and method for making sameINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jul 22, 2014·0 cites·19 claims
- 1253US2009160053A1Method of manufacturing a semiconducotor deviceINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 1352US8759207B2Semiconductor structure and method for making sameINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jun 24, 2014·0 cites·35 claims
- 1449US7772105B2Semiconductor component with plastic housing, and process for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 10, 2010·0 cites·8 claims
- 1548US9041226B2Chip arrangement and a method of manufacturing a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 26, 2015·0 cites·20 claims
- 1648US2011291274A1Method of manufacturing a semiconductor deviceMEYER THORSTEN·Filed 2011·Application pending·0 cites
- 1746US7327023B2Semiconductor component with plastic housing, and process for producing the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 5, 2008·0 cites·12 claims
- 1841US8072071B2Semiconductor device including conductive elementSTEINER RAINER·Filed 2009·Granted Dec 6, 2011·0 cites·21 claims
- 1941US2007018308A1Electronic component and electronic configurationSCHOTT ALBERT·Filed 2006·Application pending·0 cites
- 2030US2011291256A1Method for Fabricating a Semiconductor Chip Package and Semiconductor Chip PackageSTEINER RAINER·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →