Inventor · disambiguated record
Yong-Liang Chen
Also filed as: CHEN YONG · CHEN YONG-LIANG
12 granted patents·5 pending applications·13 citations·filing 2005–2024
84Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD5HONGFUJIN PREC IND SHENZHEN4HUANENG SHANXI COMPREHENSIVE ENERGY CO LTD3ADVANCED SEMICONDUCTOR ENG1DOW GLOBAL TECHNOLOGIES LLC1
Top patents by PatentIndex Score
17 records- 0179US12057705B1Power control method for wind power and photovoltaic combined power generationHUANENG SHANXI COMPREHENSIVE ENERGY CO LTD·Filed 2024·Granted Aug 6, 2024·1 cites·8 claims
- 0265US2024425394A1Composite ozone catalyst, preparation method and use thereofJIANGSU ENVIRONMENTAL ENGINEERING TECH CO LTD·Filed 2024·Application pending·0 cites
- 0360US8525336B2Semiconductor package and method of fabricating the sameLIN PANG-CHUN·Filed 2012·Granted Sep 3, 2013·1 cites·5 claims
- 0459US7857666B2Cable connector and method of making the sameHONGFUJIN PREC IND SHENZHEN·Filed 2008·Granted Dec 28, 2010·7 cites·10 claims
- 0554US12460621B1Multi-blade wind turbineHUANENG SHANXI COMPREHENSIVE ENERGY CO LTD·Filed 2024·Granted Nov 4, 2025·0 cites·3 claims
- 0653US2023235144A1Article with Crosslinked Foam Layer Adhered to SubstrateDOW GLOBAL TECHNOLOGIES LLC·Filed 2020·Application pending·0 cites
- 0751US12338593B2Adjustable platform for installing wind turbine generatorHUANENG SHANXI COMPREHENSIVE ENERGY CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·9 claims
- 0851US9029203B2Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted May 12, 2015·0 cites·6 claims
- 0947US7824217B2Cable connector terminal module and method for making the sameHONGFUJIN PREC IND SHENZHEN·Filed 2008·Granted Nov 2, 2010·2 cites·10 claims
- 1046US11519088B2Titanium sub-oxide/ruthenium oxide composite electrode and preparation method and application thereofIANGSU PROVINCIAL ACADEMY ENVIRONMENTAL SCIENCE·Filed 2020·Granted Dec 6, 2022·0 cites·9 claims
- 1143US7674116B2Cable connectorHONGFUJIN PREC IND SHENZHEN·Filed 2008·Granted Mar 9, 2010·1 cites·10 claims
- 1241US9257311B2Method of fabricating a semiconductor package with heat dissipating structure having a deformed supporting portionSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Feb 9, 2016·0 cites·8 claims
- 1341US2014239475A1Packaging substrate, semiconductor package and fabrication methods thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1440US7967633B2Cable connector terminal module and method for making the sameHONGFUJIN PREC IND SHENZHEN·Filed 2010·Granted Jun 28, 2011·0 cites·5 claims
- 1539US7109740B2Method for retesting semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Sep 19, 2006·1 cites·6 claims
- 1638US2013009311A1Semiconductor carrier, package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Application pending·0 cites
- 1734US2008099902A1Insertion-type semiconductor device and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →