Inventor · disambiguated record
Seunghyun Ahn
Also filed as: AHN SEUNGHYUN
6 granted patents·5 pending applications·8 citations·filing 2011–2025
73Inventor score
Top patents by PatentIndex Score
11 records- 0185US10151943B2Irregular shape display device having holeLG DISPLAY CO LTD·Filed 2016·Granted Dec 11, 2018·3 cites·22 claims
- 0272US8058221B2Composition for removing a photoresist and method of manufacturing semiconductor device using the compositionKANG DONG-MIN·Filed 2011·Granted Nov 15, 2011·2 cites·8 claims
- 0366US8129322B2Photosensitive-resin remover composition and method of fabricating semiconductor device using the sameLEE AHN-HO·Filed 2011·Granted Mar 6, 2012·3 cites·3 claims
- 0464US2025145783A1Composite material laminate and exterior material using the sameSK INNOVATION CO LTD·Filed 2024·Application pending·0 cites
- 0555US2023405968A1Sandwich panel for protective cover of battery pack for electric vehicle, manufacturing method therefor, and protective cover of electric vehicle battery pack comprising sameLX HAUSYS LTD·Filed 2021·Application pending·0 cites
- 0655US2025301869A1Display ApparatusLG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 0749US8486880B2Composition for removing a photoresist and method of manufacturing semiconductor device using the compositionKANG DONG-MIN·Filed 2011·Granted Jul 16, 2013·0 cites·12 claims
- 0848US11511532B2Vehicle seatback cover and manufacturing method thereofLG HAUSYS LTD·Filed 2020·Granted Nov 29, 2022·0 cites·11 claims
- 0945US2023356499A1Molded Body, Sandwich Panel Using Same And Method For Manufacturing SameLX HAUSYS LTD·Filed 2020·Application pending·0 cites
- 1043US8801958B2Titanium etchant composition and method of forming a semiconductor device using the sameKANG DONG-MIN·Filed 2011·Granted Aug 12, 2014·0 cites·7 claims
- 1142US2013192722A1Flux compositions for forming a solder bump and methods of fabricating a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →