Inventor · disambiguated record
Heiko Hommen
Also filed as: HOMMEN HEIKO
7 granted patents·1 pending application·61 citations·filing 2002–2006
82Inventor score
Top patents by PatentIndex Score
8 records- 0186US6684124B2Method for controlling a processing device for a sequential processing of semiconductor wafersINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 27, 2004·40 cites·11 claims
- 0258US7401549B2Arrangement for transferring information/structures to wafersINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jul 22, 2008·10 cites·28 claims
- 0351US6979522B2Method for exposing at least one or at least two semiconductor wafersINFINEON TECHNOLOGIES AG·Filed 2003·Granted Dec 27, 2005·3 cites·14 claims
- 0444US7186484B2Method for determining the relative positional accuracy of two structure elements on a waferINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 6, 2007·3 cites·11 claims
- 0543US7310129B2Method for carrying out a double or multiple exposureINFINEON TECHNOLOGIES AG·Filed 2004·Granted Dec 18, 2007·2 cites·14 claims
- 0643US7245351B2Alignment mark for coarse alignment and fine alignment of a semiconductor wafer in an exposure toolINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jul 17, 2007·3 cites·12 claims
- 0739US2008079920A1Wafer exposure device and methodHOMMEN HEIKO·Filed 2006·Application pending·0 cites
- 0833US6896999B2Method of exposing a semiconductor wafer in an exposerINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 24, 2005·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →