Inventor · disambiguated record
Terry G. Sparks
Also filed as: SPARKS TERRY · SPARKS TERRY G · SPARKS TERRY GRANT
18 granted patents·3 pending applications·498 citations·filing 1996–2012
95Inventor score
Top patents by PatentIndex Score
21 records- 0191US5880018AMethod for manufacturing a low dielectric constant inter-level integrated circuit structureMOTOROLA INC·Filed 1996·Granted Mar 9, 1999·226 cites·50 claims
- 0287US7544605B2Method of making a contact on a backside of a dieFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jun 9, 2009·15 cites·20 claims
- 0381US7741218B2Conductive via formation utilizing electroplatingFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jun 22, 2010·7 cites·22 claims
- 0480US6838354B2Method for forming a passivation layer for air gap formationFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jan 4, 2005·24 cites·17 claims
- 0580US6127258AMethod for forming a semiconductor deviceMOTOROLA INC·Filed 1998·Granted Oct 3, 2000·55 cites·20 claims
- 0679US6858542B2Semiconductor fabrication method for making small featuresFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Feb 22, 2005·24 cites·19 claims
- 0776US7935631B2Method of forming a continuous layer of a first metal selectively on a second metal and an integrated circuit formed from the methodFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted May 3, 2011·7 cites·14 claims
- 0876US6924184B2Semiconductor device and method for forming a semiconductor device using post gate stack planarizationFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 2, 2005·27 cites·24 claims
- 0970US6686633B1Semiconductor device, memory cell, and processes for forming themMOTOROLA INC·Filed 2000·Granted Feb 3, 2004·16 cites·20 claims
- 1069US6232235B1Method of forming a semiconductor deviceMOTOROLA INC·Filed 1998·Granted May 15, 2001·31 cites·21 claims
- 1168US8105890B2Method of forming a semiconductor structureSPARKS TERRY·Filed 2005·Granted Jan 31, 2012·3 cites·21 claims
- 1268US6372665B1Method for forming a semiconductor deviceMOTOROLA INC·Filed 2000·Granted Apr 16, 2002·13 cites·21 claims
- 1367US6566264B1Method for forming an opening in a semiconductor device substrateMOTOROLA INC·Filed 2000·Granted May 20, 2003·10 cites·15 claims
- 1464US6184073B1Process for forming a semiconductor device having an interconnect or conductive film electrically insulated from a conductive member or regionMOTOROLA INC·Filed 1997·Granted Feb 6, 2001·27 cites·14 claims
- 1563US8587070B2Method of forming a semiconductor structureSPARKS TERRY·Filed 2012·Granted Nov 19, 2013·1 cites·20 claims
- 1661US6884727B2Semiconductor fabrication process for modifying the profiles of patterned featuresFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Apr 26, 2005·8 cites·16 claims
- 1758US7955968B2Pseudo hybrid structure for low K interconnect integrationFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Jun 7, 2011·1 cites·21 claims
- 1844US6245686B1Process for forming a semiconductor device and a process for operating an apparatusMOTOROLA INC·Filed 2000·Granted Jun 12, 2001·3 cites·20 claims
- 1943US2011027999A1Etch method in the manufacture of an integrated circuitFREESCALE SEMICONDUCTOR INC·Filed 2006·Application pending·0 cites
- 2042US2008113505A1Method of forming a through-substrate viaSPARKS TERRY G·Filed 2006·Application pending·0 cites
- 2140US2009325106A1Method for Implant Imaging with Spin-on Hard MasksCONLEY WILLARD E·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →