Inventor · disambiguated record
Rao V. Vallabhaneni
Also filed as: VALLABHANENI RAO · VALLABHANENI RAO V · VALLABHANENI RAO VENKATESWARA
27 granted patents·2 pending applications·578 citations·filing 1991–2003
97Inventor score
Files withIBM29
Top patents by PatentIndex Score
29 records- 0190US6319829B1Enhanced interconnection to ceramic substratesIBM·Filed 1999·Granted Nov 20, 2001·79 cites·11 claims
- 0287US6312791B1Multilayer ceramic substrate with anchored padIBM·Filed 2000·Granted Nov 6, 2001·36 cites·19 claims
- 0386US5283104AVia paste compositions and use thereof to form conductive vias in circuitized ceramic substratesIBM·Filed 1991·Granted Feb 1, 1994·80 cites·31 claims
- 0480US6187418B1Multilayer ceramic substrate with anchored padIBM·Filed 1999·Granted Feb 13, 2001·40 cites·35 claims
- 0574US6124041ACopper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1999·Granted Sep 26, 2000·35 cites·10 claims
- 0671US5073180AMethod for forming sealed co-fired glass ceramic structuresIBM·Filed 1991·Granted Dec 17, 1991·42 cites·60 claims
- 0770US6199747B1High temperature refractory joining pasteIBM·Filed 1999·Granted Mar 13, 2001·31 cites·33 claims
- 0869US5337475AProcess for producing ceramic circuit structures having conductive viasIBM·Filed 1992·Granted Aug 16, 1994·37 cites·16 claims
- 0967US6291272B1Structure and process for making substrate packages for high frequency applicationIBM·Filed 1999·Granted Sep 18, 2001·33 cites·32 claims
- 1064US6653776B1Discrete magnets in dielectric forming metal/ceramic laminate and process thereofIBM·Filed 2000·Granted Nov 25, 2003·4 cites·42 claims
- 1164US6117367APastes for improved substrate dimensional controlIBM·Filed 1998·Granted Sep 12, 2000·22 cites·10 claims
- 1263US5787578AMethod of selectively depositing a metallic layer on a ceramic substrateIBM·Filed 1996·Granted Aug 4, 1998·31 cites·19 claims
- 1358US6955777B2Method of forming a plate for dispensing chemicalsIBM·Filed 2003·Granted Oct 18, 2005·2 cites·13 claims
- 1453US6238741B1Single mask screening processIBM·Filed 1998·Granted May 29, 2001·16 cites·21 claims
- 1551US6974358B2Discrete magnets in dielectric forming metal/ceramic laminate and process thereofIBM·Filed 2003·Granted Dec 13, 2005·1 cites·33 claims
- 1651US2005077657A1A Method of Making a Multichannel and Multilayer Pharmaceutical DeviceIBM·Filed 2003·Application pending·0 cites
- 1750US5925443ACopper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1991·Granted Jul 20, 1999·14 cites·5 claims
- 1849US6096565AMulti-layer glass ceramic module with superconductor wiringIBM·Filed 1999·Granted Aug 1, 2000·14 cites·5 claims
- 1947US5763093AAluminum nitride body having graded metallurgyIBM·Filed 1996·Granted Jun 9, 1998·10 cites·11 claims
- 2045US5682589AAluminum nitride body having graded metallurgyIBM·Filed 1996·Granted Oct 28, 1997·9 cites·12 claims
- 2145US5552107AAluminum nitride body having graded metallurgyIBM·Filed 1995·Granted Sep 3, 1996·9 cites·6 claims
- 2240US6494758B1Process of forming metal/ferrite laminated magnetIBM·Filed 1999·Granted Dec 17, 2002·5 cites·31 claims
- 2340US5525761ACopper-based paste containing refractory metal additions for densification controlIBM·Filed 1995·Granted Jun 11, 1996·7 cites·6 claims
- 2436US6002951AMulti-layer ceramic substrate having high TC superconductor circuitryIBM·Filed 1997·Granted Dec 14, 1999·5 cites·8 claims
- 2536US5512711ACopper-based paste containing refractory metal additions for densification controlIBM·Filed 1994·Granted Apr 30, 1996·6 cites·14 claims
- 2636US2001006116A1Single mask screening process and structure produced therebyIBM·Filed 2001·Application pending·0 cites
- 2735US6376054B1Surface metallization structure for multiple chip test and burn-inIBM·Filed 1999·Granted Apr 23, 2002·5 cites·22 claims
- 2834US5552232AAluminum nitride body having graded metallurgyIBM·Filed 1994·Granted Sep 3, 1996·4 cites·10 claims
- 2930US6358439B1Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1995·Granted Mar 19, 2002·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →