Inventor · disambiguated record
Jun Chung Hsu
Also filed as: HSU JUN C · HSU JUN CHUNG
23 granted patents·16 pending applications·73 citations·filing 2005–2023
93Inventor score
Top patents by PatentIndex Score
39 records- 0196US9721903B2Vertical interconnects for self shielded system in package (SiP) modulesAPPLE INC·Filed 2015·Granted Aug 1, 2017·31 cites·20 claims
- 0290US11862597B2Asymmetric stackup structure for SoC package substratesAPPLE INC·Filed 2021·Granted Jan 2, 2024·2 cites·20 claims
- 0389US9899239B2Carrier ultra thin substrateAPPLE INC·Filed 2015·Granted Feb 20, 2018·6 cites·17 claims
- 0488US10115677B2Vertical interconnects for self shielded system in package (SiP) modulesAPPLE INC·Filed 2017·Granted Oct 30, 2018·5 cites·18 claims
- 0586US10522475B2Vertical interconnects for self shielded system in package (SiP) modulesAPPLE INC·Filed 2018·Granted Dec 31, 2019·4 cites·19 claims
- 0679US9305853B2Ultra fine pitch PoP coreless packageAPPLE INC·Filed 2013·Granted Apr 5, 2016·4 cites·20 claims
- 0773US12322721B2Asymmetric Stackup Structure for SoC package substratesAPPLE INC·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 0873US7768131B1Package structure preventing solder overflow on substrate solder padsKINSUS INTERCONNECT TECH CORP·Filed 2009·Granted Aug 3, 2010·8 cites·12 claims
- 0968US11908819B2Semiconductor packaging substrate fine pitch metal bump and reinforcement structuresAPPLE INC·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 1068US11545455B2Semiconductor packaging substrate fine pitch metal bump and reinforcement structuresAPPLE INC·Filed 2019·Granted Jan 3, 2023·1 cites·22 claims
- 1165US10535611B2Substrate-less integrated componentsAPPLE INC·Filed 2016·Granted Jan 14, 2020·1 cites·18 claims
- 1265US8547548B1Final defect inspection systemKINSUS INTERCONNECT TECH CORP·Filed 2012·Granted Oct 1, 2013·1 cites·16 claims
- 1363US9633953B2Methodology to achieve zero warpage for IC packageAPPLE INC·Filed 2014·Granted Apr 25, 2017·1 cites·20 claims
- 1461US8315063B2Solder pad structure with high bondability to solder ballHSU JUN-CHUNG·Filed 2009·Granted Nov 20, 2012·3 cites·5 claims
- 1561US7805835B2Method for selectively processing surface tension of solder mask layer in circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2008·Granted Oct 5, 2010·3 cites·2 claims
- 1660US10109593B2Self shielded system in package (SiP) modulesAPPLE INC·Filed 2015·Granted Oct 23, 2018·1 cites·18 claims
- 1757US7662662B2Method for manufacturing carrier substrateKINSUS INTERCONNECT TECH CORP·Filed 2007·Granted Feb 16, 2010·2 cites·4 claims
- 1856US10991659B2Substrate-less integrated componentsAPPLE INC·Filed 2019·Granted Apr 27, 2021·0 cites·18 claims
- 1954US2025046689A1Routing Substrates with Cavities for Component StackingAPPLE INC·Filed 2023·Application pending·0 cites
- 2050US2018082858A1Carrier ultra thin substrateAPPLE INC·Filed 2017·Application pending·0 cites
- 2149US9570367B2Ultra fine pitch PoP coreless packageAPPLE INC·Filed 2016·Granted Feb 14, 2017·0 cites·20 claims
- 2249US2015140262A1Insulation layer structureKINSUS INTERCONNECT TECH CORP·Filed 2013·Application pending·0 cites
- 2349US2022336342A1Wiring Trace Morphology Structure for High Speed ApplicationsAPPLE INC·Filed 2021·Application pending·0 cites
- 2445US12494433B23D embedded redistribution layers for IC substrate packagingAPPLE INC·Filed 2022·Granted Dec 9, 2025·0 cites·18 claims
- 2544US8837808B2Method of final defect inspectionKINSUS INTERCONNECT TECH CORP·Filed 2012·Granted Sep 16, 2014·0 cites·14 claims
- 2644US2007111491A1Process for electroplating metal layer without plating lines after the solder mask processHSU JUN C·Filed 2005·Application pending·0 cites
- 2744US2007108619A1Bonding pad with high bonding strength to solder ball and bumpHSU JUN C·Filed 2005·Application pending·0 cites
- 2844US2015230342A1Novel structure achieving fine through hole pitch for integrated circuit substratesAPPLE INC·Filed 2014·Application pending·0 cites
- 2944US2013219713A1Method of manufacturing a laminate circuit board with a multilayer circuit structureKINSUS INTERCONNECT TECH CORP·Filed 2012·Application pending·0 cites
- 3044US2015027756A1Circuit board structure for high frequency signalsKINSUS INTERCONNECT TECH CORP·Filed 2013·Application pending·0 cites
- 3143US2011061234A1Method For Fabricating Carrier Board Having No Conduction LineHSU JUN-CHUNG·Filed 2009·Application pending·0 cites
- 3241US8754328B2Laminate circuit board with a multi-layer circuit structureKINSUS INTERCONNECT TECH CORP·Filed 2012·Granted Jun 17, 2014·0 cites·14 claims
- 3340US2011049703A1Flip-Chip Package StructureHSU JUN-CHUNG·Filed 2009·Application pending·0 cites
- 3440US2015271915A1Enhanced chip board package structureKINSUS INTERCONNECT TECH CORP·Filed 2014·Application pending·0 cites
- 3539US2015041183A1Chip board package structureKINSUS INTERCONNECT TECH CORP·Filed 2013·Application pending·0 cites
- 3638US9351409B2Method of manufacturing a thin support package structureKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted May 24, 2016·0 cites·5 claims
- 3738US2015041205A1Thin package structure with enhanced strengthKINSUS INTERCONNECT TECH CORP·Filed 2013·Application pending·0 cites
- 3837US2013255858A1Method of manufacturing a laminate circuit boardHSU JUN-CHUNG·Filed 2012·Application pending·0 cites
- 3937US2013284500A1Laminate circuit board structureHSU JUN-CHUNG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →