Inventor · disambiguated record
Shinsuke Asada
Also filed as: ASADA SHINSUKE
14 granted patents·1 pending application·48 citations·filing 2005–2021
89Inventor score
Top patents by PatentIndex Score
15 records- 0183US7862874B2Welded resin materialMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Jan 4, 2011·7 cites·3 claims
- 0277US9917064B2Semiconductor device with a plate-shaped lead terminalMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Mar 13, 2018·3 cites·16 claims
- 0377US7412895B2Semiconductor pressure sensor and die for molding a semiconductor pressure sensorMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Aug 19, 2008·6 cites·8 claims
- 0477US7391101B2Semiconductor pressure sensorMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Jun 24, 2008·9 cites·6 claims
- 0576US8749977B2Power semiconductor module and its attachment structureASADA SHINSUKE·Filed 2011·Granted Jun 10, 2014·5 cites·14 claims
- 0675US9129949B2Power semiconductor moduleASADA SHINSUKE·Filed 2011·Granted Sep 8, 2015·5 cites·12 claims
- 0774US7603908B2Semiconductor pressure sensor, manufacturing method thereof, and die for molding semiconductor pressure sensorMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Oct 20, 2009·5 cites·7 claims
- 0870US8110062B2Welding method and welding apparatus for resin memberASADA SHINSUKE·Filed 2008·Granted Feb 7, 2012·2 cites·8 claims
- 0968US8597755B2Resin welded body and manufacturing method thereofFUJIMOTO SEIZO·Filed 2007·Granted Dec 3, 2013·5 cites·3 claims
- 1061US9698091B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jul 4, 2017·1 cites·8 claims
- 1157US11901326B2Semiconductor device with branch electrode terminal and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Feb 13, 2024·0 cites·22 claims
- 1254US10573570B2Semiconductor device and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Feb 25, 2020·0 cites·8 claims
- 1343US9691730B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jun 27, 2017·0 cites·4 claims
- 1441US2007017294A1Semiconductor pressure sensorMITSUBISHI ELECTRIC CORP·Filed 2005·Application pending·0 cites
- 1540US10388581B2Semiconductor device having press-fit terminals disposed in recesses in a case frameMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Aug 20, 2019·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →