Inventor · disambiguated record
Shigeyuki Maruyama
Also filed as: MARUYAMA SHIGEYUKI
69 granted patents·4 pending applications·1,572 citations·filing 1984–2013
99Inventor score
Files withFUJITSU LTD60FUJITSU SEMICONDUCTOR LTD5FUJITSU MICROELECTRONICS LTD2MARUYAMA SHIGEYUKI2TASHIRO KAZUHIRO2
Top patents by PatentIndex Score
73 records- 0196US6228684B1Wafer-level package, a method of manufacturing thereof and a method of manufacturing semiconductor devices from such a wafer-level packageFUJITSU LTD·Filed 1999·Granted May 8, 2001·139 cites·5 claims
- 0294US6927343B2Contactor for testing miniaturized devices and componentsFUJITSU LTD·Filed 2002·Granted Aug 9, 2005·72 cites·32 claims
- 0393US7129726B2Testing device and testing method of a semiconductor deviceFUJITSU LTD·Filed 2005·Granted Oct 31, 2006·26 cites·15 claims
- 0493US6661247B2Semiconductor testing deviceFUJITSU LTD·Filed 2001·Granted Dec 9, 2003·41 cites·14 claims
- 0592US7399990B2Wafer-level package having test terminalFUJITSU LTD·Filed 2006·Granted Jul 15, 2008·17 cites·3 claims
- 0692US6881611B1Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the deviceFUJITSU LTD·Filed 2000·Granted Apr 19, 2005·85 cites·24 claims
- 0792US6229320B1IC socket, a test method using the same and an IC socket mounting mechanismFUJITSU LTD·Filed 1997·Granted May 8, 2001·82 cites·22 claims
- 0892US5828224ATest carrier for semiconductor integrated circuit and method of testing semiconductor integrated circuitFUJITSU LTD·Filed 1996·Granted Oct 27, 1998·92 cites·18 claims
- 0991US7471096B2Contactor for electronic parts and a contact methodFUJITSU LTD·Filed 2006·Granted Dec 30, 2008·28 cites·10 claims
- 1091US7202679B2Contactor having conductive particles in a hole as a contact electrodeFUJITSU LTD·Filed 2006·Granted Apr 10, 2007·18 cites·21 claims
- 1191US7071487B2Wafer-level package having test terminalFUJITSU LTD·Filed 2004·Granted Jul 4, 2006·42 cites·9 claims
- 1289US7112889B1Semiconductor device having an alignment mark formed by the same material with a metal postFUJITSU LTD·Filed 2000·Granted Sep 26, 2006·36 cites·9 claims
- 1389US6563330B1Probe card and method of testing wafer having a plurality of semiconductor devicesFUJITSU LTD·Filed 2000·Granted May 13, 2003·37 cites·18 claims
- 1489US6535002B2IC socket, a test method using the same and an IC socket mounting mechanismFUJITSU LTD·Filed 2001·Granted Mar 18, 2003·36 cites·8 claims
- 1588US7642551B2Wafer-level package having test terminalFUJITSU MICROELECTRONICS LTD·Filed 2008·Granted Jan 5, 2010·11 cites·1 claims
- 1686US6939142B2Semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact pieceFUJITSU LTD·Filed 2000·Granted Sep 6, 2005·30 cites·10 claims
- 1786US6762431B2Wafer-level package with test terminalsFUJITSU LTD·Filed 2001·Granted Jul 13, 2004·29 cites·2 claims
- 1885US4604572ADevice for testing semiconductor devices at a high temperatureFUJITSU LTD·Filed 1984·Granted Aug 5, 1986·51 cites·10 claims
- 1984US6767219B2Contactor, method for manufacturing such contactor, and testing method using such contactorFUJITSU LTD·Filed 2002·Granted Jul 27, 2004·30 cites·34 claims
- 2084US6466046B1Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactorFUJITSU LTD·Filed 1999·Granted Oct 15, 2002·56 cites·20 claims
- 2183US5986459ASemiconductor device testing carrier and method of fixing semiconductor device to testing carrierFUJITSU LTD·Filed 1997·Granted Nov 16, 1999·71 cites·13 claims
- 2282US7267559B2Anisotropic conductive sheet, production process, contact structure, electronic device and inspection apparatus for operation testFUJITSU LTD·Filed 2002·Granted Sep 11, 2007·27 cites·20 claims
- 2382US6791345B2Contactor for testing semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2002·Granted Sep 14, 2004·22 cites·12 claims
- 2481US7430798B2Electronic component attaching toolFUJITSU LTD·Filed 2005·Granted Oct 7, 2008·10 cites·20 claims
- 2581US5757199ATest carrier for semiconductor integrated circuit and method of testing semiconductor integrated circuitFUJITSU LTD·Filed 1995·Granted May 26, 1998·47 cites·21 claims
- 2680US6249135B1Method and apparatus for passive optical characterization of semiconductor substrates subjected to high energy (MEV) ion implantation using high-injection surface photovoltageFUJITSU LTD·Filed 1999·Granted Jun 19, 2001·34 cites·3 claims
- 2779US8268670B2Method of semiconductor device protectionTASHIRO KAZUHIRO·Filed 2011·Granted Sep 18, 2012·4 cites·2 claims
- 2878US6630839B1Contactor, a method of manufacturing the contactor and a device and method of testing electronic component using the contactorFUJITSU LTD·Filed 2000·Granted Oct 7, 2003·19 cites·5 claims
- 2978US6555764B1Integrated circuit contactor, and method and apparatus for production of integrated circuit contactorFUJITSU LTD·Filed 1999·Granted Apr 29, 2003·36 cites·3 claims
- 3078US6545363B2Contactor having conductive particles in a hole as a contact electrodeFUJITSU LTD·Filed 2001·Granted Apr 8, 2003·19 cites·6 claims
- 3178US6433563B1Probe card with rigid base having apertures for testing semiconductor device, and semiconductor device test method using probe cardFUJITSU LTD·Filed 1999·Granted Aug 13, 2002·50 cites·14 claims
- 3277US6696754B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 2002·Granted Feb 24, 2004·20 cites·10 claims
- 3376US7240432B2Method of manufacturing a semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact pieceFUJITSU LTD·Filed 2005·Granted Jul 10, 2007·4 cites·9 claims
- 3474US7145250B2LSI package, LSI element testing method, and semiconductor device manufacturing methodFUJITSU LTD·Filed 2005·Granted Dec 5, 2006·6 cites·20 claims
- 3574US6781395B2Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactorFUJITSU LTD·Filed 2003·Granted Aug 24, 2004·13 cites·1 claims
- 3673US6784657B2Handling apparatus and test set using the handling apparatusFUJITSU LTD·Filed 2002·Granted Aug 31, 2004·18 cites·25 claims
- 3772US8051554B2IC socket with attached electronic componentFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Nov 8, 2011·3 cites·2 claims
- 3871US8759119B2Method of testing a semiconductor device and suctioning a semiconductor device in the wafer stateFUJITSU SEMICONDUCTOR LTD·Filed 2013·Granted Jun 24, 2014·2 cites·4 claims
- 3970US6603325B2Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactorFUJITSU LTD·Filed 2002·Granted Aug 5, 2003·10 cites·5 claims
- 4068US7161370B2Semiconductor testing deviceFUJITSU LTD·Filed 2005·Granted Jan 9, 2007·2 cites·1 claims
- 4168US6472744B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 1998·Granted Oct 29, 2002·31 cites·17 claims
- 4267US6046598ATest board and a test method using the same providing improved electrical connectionFUJITSU LTD·Filed 1997·Granted Apr 4, 2000·27 cites·33 claims
- 4366US7807481B2Method of semiconductor device protection, package of semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Oct 5, 2010·2 cites·3 claims
- 4466US7518388B2Contactor for electronic components and test method using the sameFUJITSU MICROELECTRONICS LTD·Filed 2007·Granted Apr 14, 2009·4 cites·13 claims
- 4566US5534785AIntegrated circuit bare chip carrierFUJITSU LTD·Filed 1995·Granted Jul 9, 1996·30 cites·6 claims
- 4665US7795552B2Contact piece member, contactor and contact methodFUJITSU SEMICONDUCTOR LTD·Filed 2007·Granted Sep 14, 2010·4 cites·2 claims
- 4763US7921906B2Temperature control method and temperature control deviceFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Apr 12, 2011·2 cites·4 claims
- 4863US7309996B2Contactor for electronic components and test method using the sameFUJITSU LTD·Filed 2004·Granted Dec 18, 2007·9 cites·3 claims
- 4962US6924174B2Method of attaching electronic component and electronic component attaching toolFUJITSU LTD·Filed 2003·Granted Aug 2, 2005·7 cites·9 claims
- 5061US7382046B2Semiconductor device protection cover, and semiconductor device unit including the coverFUJITSU LTD·Filed 2004·Granted Jun 3, 2008·7 cites·16 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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