Inventor · disambiguated record
Ronald L. Mendelson
Also filed as: MENDELSON RONALD L · MENDELSON RONALD LEE
14 granted patents·1 pending application·593 citations·filing 1997–2008
94Inventor score
Top patents by PatentIndex Score
15 records- 0197US6271102B1Method and system for dicing wafers, and semiconductor structures incorporating the products thereofIBM·Filed 1998·Granted Aug 7, 2001·125 cites·11 claims
- 0294US6022791AChip crack stopIBM·Filed 1997·Granted Feb 8, 2000·222 cites·15 claims
- 0393US6368881B1Wafer thickness control during backside grindIBM·Filed 2000·Granted Apr 9, 2002·54 cites·28 claims
- 0485US6887126B2Wafer thickness control during backside grindIBM·Filed 2001·Granted May 3, 2005·25 cites·14 claims
- 0583US6915795B2Method and system for dicing wafers, and semiconductor structures incorporating the products thereofIBM·Filed 2003·Granted Jul 12, 2005·20 cites·11 claims
- 0683US6806578B2Copper pad structureIBM·Filed 2000·Granted Oct 19, 2004·32 cites·21 claims
- 0774US6153536AMethod for mounting wafer frame at back side grinding (BSG) toolIBM·Filed 1999·Granted Nov 28, 2000·42 cites·20 claims
- 0863US6600213B2Semiconductor structure and package including a chip having chamfered edgesIBM·Filed 2001·Granted Jul 29, 2003·7 cites·8 claims
- 0963US5888838AMethod and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation informationIBM·Filed 1998·Granted Mar 30, 1999·25 cites·17 claims
- 1060US6222145B1Mechanical strength die sortingIBM·Filed 1998·Granted Apr 24, 2001·22 cites·25 claims
- 1151US7915732B2Production of integrated circuit chip packages prohibiting formation of micro solder ballsINTERNAT BUSINESS MAHINES CORP·Filed 2008·Granted Mar 29, 2011·0 cites·4 claims
- 1251US7134933B2Wafer thickness control during backside grindIBM·Filed 2005·Granted Nov 14, 2006·0 cites·8 claims
- 1351US6171873B1Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation informationIBM·Filed 1998·Granted Jan 9, 2001·15 cites·5 claims
- 1449US6605526B1Wirebond passivation pad connection using heated capillaryIBM·Filed 2000·Granted Aug 12, 2003·4 cites·17 claims
- 1538US2001052644A1Copper pad structureIBM·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →