Inventor · disambiguated record
Heung-Kyu Kim
Also filed as: KIM HEUNG-KYU
4 granted patents·2 pending applications·2 citations·filing 2004–2016
61Inventor score
Top patents by PatentIndex Score
6 records- 0159US7795719B2Electro component packageSAMSUNG ELECTRO MECH·Filed 2009·Granted Sep 14, 2010·1 cites·5 claims
- 0248US8607448B2Method of manufacturing a printed circuit board having micro strip lineKIM HEUNG-KYU·Filed 2012·Granted Dec 17, 2013·0 cites·3 claims
- 0347US8294529B2Printed circuit board comprised of an insulating layer having buried microstrip lines and conductors with widths that narrow into the insulation layerKIM HEUNG-KYU·Filed 2009·Granted Oct 23, 2012·1 cites·7 claims
- 0443US8674781B2Printed circuit board comprised of an insulating layer having buried microstrip lines and conductors with widths that narrow into the insulation layerKIM HEUNG-KYU·Filed 2012·Granted Mar 18, 2014·0 cites·4 claims
- 0534US2005139390A1Printed circuit board and package having oblique viasFiled 2004·Application pending·0 cites
- 0630US2016374198A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →