Inventor · disambiguated record
Dennis Buese
Also filed as: BUESE DENNIS
5 granted patents·57 citations·filing 2000–2009
78Inventor score
Files withMEMC ELECTRONIC MATERIALS5
Top patents by PatentIndex Score
5 records- 0182US6257954B1Apparatus and process for high temperature wafer edge polishingMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Jul 10, 2001·27 cites·23 claims
- 0275US6479386B1Process for reducing surface variations for polished waferMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Nov 12, 2002·22 cites·37 claims
- 0363US7846007B2System and method for dressing a wafer polishing padMEMC ELECTRONIC MATERIALS·Filed 2009·Granted Dec 7, 2010·3 cites·22 claims
- 0462US7846006B2Dressing a wafer polishing padMEMC ELECTRONIC MATERIALS·Filed 2007·Granted Dec 7, 2010·3 cites·12 claims
- 0542US6398631B1Method and apparatus to place wafers into and out of machineMEMC ELECTRONIC MATERIALS·Filed 2001·Granted Jun 4, 2002·2 cites·29 claims
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