Inventor · disambiguated record
Kerry Bernstein
Also filed as: BERNSTEIN KERRY
143 granted patents·7 pending applications·2,295 citations·filing 1983–2019
99Inventor score
Top patents by PatentIndex Score
150 records- 0199US7750682B2CMOS back-gated keeper techniqueIBM·Filed 2008·Granted Jul 6, 2010·120 cites·12 claims
- 0299US7692944B23-dimensional integrated circuit architecture, structure and method for fabrication thereofIBM·Filed 2008·Granted Apr 6, 2010·256 cites·15 claims
- 0398US7115920B2FinFET transistor and circuitIBM·Filed 2004·Granted Oct 3, 2006·175 cites·6 claims
- 0497US7605429B2Hybrid crystal orientation CMOS structure for adaptive well biasing and for power and performance enhancementIBM·Filed 2005·Granted Oct 20, 2009·127 cites·15 claims
- 0597US7285477B1Dual wired integrated circuit chipsIBM·Filed 2006·Granted Oct 23, 2007·49 cites·23 claims
- 0697US7183142B2FinFETs with long gate length at high densityIBM·Filed 2005·Granted Feb 27, 2007·58 cites·20 claims
- 0796US7195971B2Method of manufacturing an intralevel decoupling capacitorIBM·Filed 2005·Granted Mar 27, 2007·26 cites·18 claims
- 0896US6326666B1DTCMOS circuit having improved speedIBM·Filed 2000·Granted Dec 4, 2001·129 cites·9 claims
- 0994US8106505B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyBERNSTEIN KERRY·Filed 2007·Granted Jan 31, 2012·18 cites·1 claims
- 1094US6882015B2Intralevel decoupling capacitor, method of manufacture and testing circuit of the sameIBM·Filed 2003·Granted Apr 19, 2005·49 cites·16 claims
- 1193US9252072B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2013·Granted Feb 2, 2016·8 cites·20 claims
- 1293US8055822B2Multicore processor having storage for core-specific operational dataIBM·Filed 2007·Granted Nov 8, 2011·32 cites·18 claims
- 1393US7928548B2Silicon heat spreader mounted in-plane with a heat source and method thereforIBM·Filed 2008·Granted Apr 19, 2011·23 cites·12 claims
- 1492US9905505B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2015·Granted Feb 27, 2018·5 cites·19 claims
- 1592US9252071B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2013·Granted Feb 2, 2016·7 cites·20 claims
- 1692US8013342B2Double-sided integrated circuit chipsIBM·Filed 2007·Granted Sep 6, 2011·19 cites·16 claims
- 1792US7408798B23-dimensional integrated circuit architecture, structure and method for fabrication thereofIBM·Filed 2006·Granted Aug 5, 2008·16 cites·5 claims
- 1892US7217978B2SRAM memories and microprocessors having logic portions implemented in high-performance silicon substrates and SRAM array portions having field effect transistors with linked bodies and method for making sameIBM·Filed 2005·Granted May 15, 2007·26 cites·51 claims
- 1991US6433587B1SOI CMOS dynamic circuits having threshold voltage controlIBM·Filed 2000·Granted Aug 13, 2002·44 cites·12 claims
- 2090US9905506B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2015·Granted Feb 27, 2018·4 cites·19 claims
- 2190US9052724B2Electro-rheological micro-channel anisotropic cooled integrated circuits and methods thereofBERNSTEIN KERRY·Filed 2012·Granted Jun 9, 2015·11 cites·21 claims
- 2290US6452251B1Damascene metal capacitorIBM·Filed 2000·Granted Sep 17, 2002·61 cites·22 claims
- 2389US7913202B2Wafer level I/O test, repair and/or customization enabled by I/O layerIBM·Filed 2007·Granted Mar 22, 2011·22 cites·18 claims
- 2489US7670927B2Double-sided integrated circuit chipsIBM·Filed 2006·Granted Mar 2, 2010·15 cites·12 claims
- 2589US7521950B2Wafer level I/O test and repair enabled by I/O layerIBM·Filed 2005·Granted Apr 21, 2009·21 cites·5 claims
- 2689US6236103B1Integrated high-performance decoupling capacitor and heat sinkIBM·Filed 1999·Granted May 22, 2001·93 cites·13 claims
- 2788US8250303B2Adaptive linesize in a cacheBERNSTEIN KERRY·Filed 2009·Granted Aug 21, 2012·17 cites·20 claims
- 2888US7960245B2Dual wired integrated circuit chipsIBM·Filed 2008·Granted Jun 14, 2011·12 cites·20 claims
- 2988US6794901B2Apparatus for reducing soft errors in dynamic circuitsIBM·Filed 2002·Granted Sep 21, 2004·33 cites·8 claims
- 3088US6677637B2Intralevel decoupling capacitor, method of manufacture and testing circuit of the sameIBM·Filed 1999·Granted Jan 13, 2004·66 cites·19 claims
- 3187US8232190B2Three dimensional vertical E-fuse structures and methods of manufacturing the sameBERNSTEIN KERRY·Filed 2007·Granted Jul 31, 2012·15 cites·11 claims
- 3286US8298906B2Trench decoupling capacitor formed by RIE lag of through silicon via (TSV) etchBERNSTEIN KERRY·Filed 2009·Granted Oct 30, 2012·14 cites·24 claims
- 3386US7629233B2Hybrid crystal orientation CMOS structure for adaptive well biasing and for power and performance enhancementIBM·Filed 2007·Granted Dec 8, 2009·18 cites·12 claims
- 3486US6548338B2Integrated high-performance decoupling capacitor and heat sinkIBM·Filed 2001·Granted Apr 15, 2003·39 cites·7 claims
- 3585US8569803B2BEOL compatible FET structrureTYBERG CHRISTY S·Filed 2012·Granted Oct 29, 2013·6 cites·13 claims
- 3684US8629554B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyBERNSTEIN KERRY·Filed 2009·Granted Jan 14, 2014·6 cites·7 claims
- 3784US7898078B1Power connector/decoupler integrated in a heat sinkIBM·Filed 2009·Granted Mar 1, 2011·11 cites·20 claims
- 3884US6956417B2Leakage compensation circuitIBM·Filed 2003·Granted Oct 18, 2005·32 cites·39 claims
- 3984US6580293B1Body-contacted and double gate-contacted differential logic circuit and method of operationIBM·Filed 2001·Granted Jun 17, 2003·27 cites·22 claims
- 4083US7462509B2Dual-sided chip attached modulesIBM·Filed 2006·Granted Dec 9, 2008·10 cites·12 claims
- 4183US7298161B2Circuitry and methodology to establish correlation between gate dielectric test site reliability and product gate reliabilityIBM·Filed 2005·Granted Nov 20, 2007·10 cites·7 claims
- 4282US8487427B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyBERNSTEIN KERRY·Filed 2009·Granted Jul 16, 2013·5 cites·11 claims
- 4382US7700410B2Chip-in-slot interconnect for 3D chip stacksIBM·Filed 2007·Granted Apr 20, 2010·9 cites·8 claims
- 4481US9301424B2Auto-compensating temperature valve controller for electro-rheological fluid micro-channel cooled integrated circuitIBM·Filed 2015·Granted Mar 29, 2016·3 cites·20 claims
- 4581US7898285B2Optimal local supply voltage determination circuitIBM·Filed 2008·Granted Mar 1, 2011·10 cites·20 claims
- 4680US10622294B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2017·Granted Apr 14, 2020·1 cites·20 claims
- 4780US10586760B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2017·Granted Mar 10, 2020·1 cites·20 claims
- 4880US8576599B2Multi-wafer 3D CAM cellATWAL JAGREET S·Filed 2012·Granted Nov 5, 2013·8 cites·7 claims
- 4980US8421126B2Double-sided integrated circuit chipsBERNSTEIN KERRY·Filed 2011·Granted Apr 16, 2013·4 cites·23 claims
- 5080US7397718B2Determining relative amount of usage of data retaining device based on potential of charge storing deviceIBM·Filed 2006·Granted Jul 8, 2008·8 cites·12 claims
Showing the top 50 of 150 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →