Inventor · disambiguated record
Shota Okade
Also filed as: OKADE SHOTA
3 granted patents·3 pending applications·4 citations·filing 2013–2020
55Inventor score
Top patents by PatentIndex Score
6 records- 0182US12103999B2Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Oct 1, 2024·2 cites·19 claims
- 0267US10104781B2Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2014·Granted Oct 16, 2018·2 cites·10 claims
- 0345US2022179308A1Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 0443US2015293443A1Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 0539US2022155681A1Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
- 0627US10564543B2Photosensitive resin composition, photosensitive element, method for producing substrate with resist pattern, and method for producing printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2015·Granted Feb 18, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →