Inventor · disambiguated record
Mihir A. Oka
Also filed as: OKA MIHIR · OKA MIHIR A
10 granted patents·5 pending applications·5 citations·filing 2012–2024
80Inventor score
Top patents by PatentIndex Score
15 records- 0173US12176318B2Thermal compression bonder nozzle with vacuum relief featuresINTEL CORP·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 0273US9859248B2Laser die backside film removal for integrated circuit (IC) packagingINTEL CORP·Filed 2016·Granted Jan 2, 2018·2 cites·20 claims
- 0367US9412702B2Laser die backside film removal for integrated circuit (IC) packagingINTEL CORP·Filed 2013·Granted Aug 9, 2016·2 cites·12 claims
- 0466US11652080B2Thermal compression bonder nozzle with vacuum relief featuresINTEL CORP·Filed 2021·Granted May 16, 2023·0 cites·13 claims
- 0564US10224299B2Sintered solder for fine pitch first-level interconnect (FLI) applicationsINTEL CORP·Filed 2016·Granted Mar 5, 2019·1 cites·14 claims
- 0659US2025391807A1Dynamic substrate thermal displacement compensationINTEL CORP·Filed 2024·Application pending·0 cites
- 0754US10515914B2Sintered solder for fine pitch first-level interconnect (FLI) applicationsINTEL CORP·Filed 2019·Granted Dec 24, 2019·0 cites·19 claims
- 0851US2024186280A1Thermocompression bonding tool for panel-level thermo-compression bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 0948US9472517B2Dry-removable protective coatingsOKA MIHIR A·Filed 2014·Granted Oct 18, 2016·0 cites·16 claims
- 1047US2017033069A1Dry-removable protective coatingsINTEL CORP·Filed 2016·Application pending·0 cites
- 1145US9530718B2DBF film as a thermal interface materialARORA HITESH·Filed 2012·Granted Dec 27, 2016·0 cites·11 claims
- 1244US9659889B2Solder-on-die using water-soluble resist system and methodINTEL CORP·Filed 2013·Granted May 23, 2017·0 cites·6 claims
- 1343US10546823B2Apparatus and method for mitigating surface imperfections on die backside film using fluorocarbon materialINTEL CORP·Filed 2015·Granted Jan 28, 2020·0 cites·13 claims
- 1434US2014175657A1Methods to improve laser mark contrast on die backside film in embedded die packagesOKA MIHIR A·Filed 2012·Application pending·0 cites
- 1532US2018315731A1Inkjet printable mask apparatus and method for solder on die technologyINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →