Inventor · disambiguated record
Tony Dambrauskas
Also filed as: DAMBRAUSKAS TONY
9 granted patents·4 pending applications·22 citations·filing 2005–2023
84Inventor score
Top patents by PatentIndex Score
13 records- 0181US9583390B2Organic thin film passivation of metal interconnectionsINTEL CORP·Filed 2016·Granted Feb 28, 2017·3 cites·12 claims
- 0281US9257276B2Organic thin film passivation of metal interconnectionsALEKSOV ALEKSANDAR·Filed 2011·Granted Feb 9, 2016·5 cites·27 claims
- 0373US9859248B2Laser die backside film removal for integrated circuit (IC) packagingINTEL CORP·Filed 2016·Granted Jan 2, 2018·2 cites·20 claims
- 0473US7354799B2Methods for anchoring a seal ring to a substrate using vias and assemblies including an anchored seal ringINTEL CORP·Filed 2005·Granted Apr 8, 2008·8 cites·29 claims
- 0568US9824991B2Organic thin film passivation of metal interconnectionsINTEL CORP·Filed 2017·Granted Nov 21, 2017·1 cites·20 claims
- 0667US9412702B2Laser die backside film removal for integrated circuit (IC) packagingINTEL CORP·Filed 2013·Granted Aug 9, 2016·2 cites·12 claims
- 0754US11935861B2Underfill flow management in electronic assembliesINTEL CORP·Filed 2020·Granted Mar 19, 2024·0 cites·16 claims
- 0852US7427565B2Multi-step etch for metal bump formationINTEL CORP·Filed 2005·Granted Sep 23, 2008·1 cites·23 claims
- 0951US2024213074A1Enhanced nozzle for disaggregated die handling during thermal compression bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 1050US2024421102A1Microelectronic assemblies including a mold material with a stress-relief trenchINTEL CORP·Filed 2023·Application pending·0 cites
- 1147US7402501B2Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing sameINTEL CORP·Filed 2006·Granted Jul 22, 2008·0 cites·22 claims
- 1247US2008251896A1Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing sameDAMBRAUSKAS TONY·Filed 2008·Application pending·0 cites
- 1340US2008237881A1Recessed solder socket in a semiconductor substrateDAMBRAUSKAS TONY·Filed 2007·Application pending·0 cites
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