Inventor · disambiguated record
Thorbjörn Ebefors
Also filed as: EBEFORS THORBJOERN · EBEFORS THORBJORN · EBEFORS THORBJÖRN
24 granted patents·3 pending applications·120 citations·filing 2003–2019
94Inventor score
Files withSILEX MICROSYSTEMS AB11EBEFORS THORBJORN4EBEFORS THORBJOERN3EBEFORS THORBJÖRN3KAELVESTEN EDVARD2
Top patents by PatentIndex Score
27 records- 0189US8637351B2Methods for making micro needles and applications thereofKAELVESTEN EDVARD·Filed 2011·Granted Jan 28, 2014·14 cites·6 claims
- 0285US9240373B2Semiconductor devices with close-packed via structures having in-plane routing and method of making sameSILEX MICROSYSTEMS AB·Filed 2013·Granted Jan 19, 2016·7 cites·14 claims
- 0385US8485416B2Bonding process and bonded structuresEBEFORS THORBJORN·Filed 2012·Granted Jul 16, 2013·8 cites·8 claims
- 0484US8308960B2Methods for making micro needles and applications thereofKAELVESTEN EDVARD·Filed 2006·Granted Nov 13, 2012·14 cites·14 claims
- 0583US9484293B2Semiconductor devices with close-packed via structures having in-plane routing and method of making sameSILEX MICROSYSTEMS AB·Filed 2015·Granted Nov 1, 2016·4 cites·6 claims
- 0675US9362139B2Method of making a semiconductor device having a functional cappingEBEFORS THORBJÖRN·Filed 2009·Granted Jun 7, 2016·7 cites·22 claims
- 0775US9224681B2CTE matched interposer and method of makingEBEFORS THORBJORN·Filed 2013·Granted Dec 29, 2015·5 cites·18 claims
- 0874US9514985B2Electroless metal through silicon viaSILEX MICROSYSTEMS AB·Filed 2013·Granted Dec 6, 2016·4 cites·6 claims
- 0973US9718674B2Thin capping for MEMS devicesSILEX MICROSYSTEMS AB·Filed 2014·Granted Aug 1, 2017·3 cites·10 claims
- 1073US9620390B2Method of making a semiconductor device having a functional cappingSILEX MICROSYSTEMS AB·Filed 2016·Granted Apr 11, 2017·2 cites·8 claims
- 1171US7560802B2Electrical connections in substratesSilex Microsystems AG·Filed 2004·Granted Jul 14, 2009·25 cites·20 claims
- 1271US7172911B2Deflectable microstructure and method of manufacturing the same through bonding of wafersSILEX MICROSYSTEMS AB·Filed 2003·Granted Feb 6, 2007·20 cites·16 claims
- 1365US9355895B2Method of providing a via hole and routing structureEBEFORS THORBJORN·Filed 2013·Granted May 31, 2016·2 cites·18 claims
- 1465US8592981B2Via structure and method thereofEBEFORS THORBJOERN·Filed 2009·Granted Nov 26, 2013·3 cites·7 claims
- 1561US8866289B2Bonding process and bonded structuresEBEFORS THORBJORN·Filed 2012·Granted Oct 21, 2014·1 cites·6 claims
- 1656US8630033B2Via structure and method thereofEBEFORS THORBJOERN·Filed 2011·Granted Jan 14, 2014·1 cites·4 claims
- 1750US9448401B2Via structure and method thereofSILEX MICROSYSTEMS AB·Filed 2013·Granted Sep 20, 2016·0 cites·10 claims
- 1849US8598676B2Barrier structureEBEFORS THORBJOERN·Filed 2012·Granted Dec 3, 2013·0 cites·7 claims
- 1949US2010053922A1Micropackaging method and devicesSILEX MICROSYSTEMS AB·Filed 2008·Application pending·0 cites
- 2048US2009302414A1Trench isolation for reduced cross talkSILEX MICROSYSTEMS AB·Filed 2008·Application pending·0 cites
- 2145US9613863B2Method for forming electroless metal through viaSILEX MICROSYSTEMS AB·Filed 2016·Granted Apr 4, 2017·0 cites·20 claims
- 2245US8729685B2Bonding process and bonded structuresEBEFORS THORBJÖRN·Filed 2010·Granted May 20, 2014·0 cites·13 claims
- 2343US9511999B2Thin film cappingSILEX MICROSYSTEMS AB·Filed 2012·Granted Dec 6, 2016·0 cites·12 claims
- 2442US9312217B2Methods for making a starting substrate wafer for semiconductor engineering having wafer through connectionsKÄLVESTEN EDVARD·Filed 2007·Granted Apr 12, 2016·0 cites·7 claims
- 2540US8729713B2Via structure and method thereofEBEFORS THORBJÖRN·Filed 2011·Granted May 20, 2014·0 cites·17 claims
- 2638US2021162457A1A device, system and method for generating an acoustic-potential field of ultrasonic wavesMYVOX AB·Filed 2019·Application pending·0 cites
- 2735US9936918B2Insulation of micro structuresKALVESTEN EDVARD·Filed 2012·Granted Apr 10, 2018·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →