Inventor · disambiguated record
Hong-Dyi Chang
Also filed as: CHANG HONG-DYI
8 granted patents·1 pending application·51 citations·filing 2009–2021
85Inventor score
Top patents by PatentIndex Score
9 records- 0191US8202776B2Method for protecting a gate structure during contact formationCHANG HONG-DYI·Filed 2009·Granted Jun 19, 2012·20 cites·20 claims
- 0286US8497169B2Method for protecting a gate structure during contact formationCHANG HONG-DYI·Filed 2012·Granted Jul 30, 2013·7 cites·15 claims
- 0384US8648446B2Method for protecting a gate structure during contact formationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 11, 2014·5 cites·20 claims
- 0484US8530326B2Method of fabricating a dummy gate structure in a gate last processLAI SU-CHEN·Filed 2012·Granted Sep 10, 2013·6 cites·17 claims
- 0584US8237227B2Dummy gate structure for gate last processLAI SU-CHEN·Filed 2009·Granted Aug 7, 2012·10 cites·14 claims
- 0679US8970015B2Method for protecting a gate structure during contact formationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 3, 2015·3 cites·20 claims
- 0756US11515239B2Quad flat no-lead package structureNOVATEK MICROELECTRONICS CORP·Filed 2021·Granted Nov 29, 2022·0 cites·25 claims
- 0849US11244891B1Integrated circuit package and dieNOVATEK MICROELECTRONICS CORP·Filed 2020·Granted Feb 8, 2022·0 cites·18 claims
- 0938US2013049192A1Stacked chip package and fabrication method thereofCHANG HONG-DYI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →