Inventor · disambiguated record
Anja Henckens
Also filed as: HENCKENS ANJA
12 granted patents·6 pending applications·5 citations·filing 2004–2023
82Inventor score
Top patents by PatentIndex Score
18 records- 0174US7511116B2Method of preparing derivatives of polyarylene vinylene and method of preparing an electronic device including sameIMEC INTER UNI MICRO ELECTR·Filed 2007·Granted Mar 31, 2009·2 cites·17 claims
- 0259US7666978B2Method of preparing derivatives of polyarylene vinylene and method of preparing an electronic device including sameIMEC·Filed 2009·Granted Feb 23, 2010·0 cites·11 claims
- 0359US7446164B2Method of preparing derivatives of polyarylene vinylene and method of preparing an electronic device including sameIMEC INTER UNI MICRO ELECTR·Filed 2007·Granted Nov 4, 2008·0 cites·20 claims
- 0459US2009183767A1Method of preparing derivatives of polyarylene vinylene and method of preparing an electronic device including sameIMEC INTER UNI MICRO ELECTR·Filed 2009·Application pending·0 cites
- 0557US9770886B2Electrically conductive adhesives comprising silver-coated particlesHENKEL AG & CO KGAA·Filed 2014·Granted Sep 26, 2017·0 cites·20 claims
- 0654US11075309B2Sinterable composition for use in solar photovoltaic cellsHENKEL AG & CO KGAA·Filed 2018·Granted Jul 27, 2021·0 cites·16 claims
- 0754US7259228B2Method of preparing derivatives of polyarylene vinylene and method of preparing an electronic device including sameLIMBURGS UNI CT·Filed 2004·Granted Aug 21, 2007·3 cites·14 claims
- 0853US12163072B2Electrically conductive adhesive for attaching solar cellsHENKEL AG & CO KGAA·Filed 2020·Granted Dec 10, 2024·0 cites·13 claims
- 0952US10920098B2Processing of polymer based inks and pastesHENKEL AG & CO KGAA·Filed 2019·Granted Feb 16, 2021·0 cites·9 claims
- 1049US2019057792A1Electrically conductive composition and applications for said compositionHENKEL AG & CO KGAA·Filed 2018·Application pending·0 cites
- 1148US12460109B2Electrically conductive silicone composition with high adhesion strengthHENKEL AG & CO KGAA·Filed 2022·Granted Nov 4, 2025·0 cites·11 claims
- 1247US2023151252A1Room temperature stable, electrically conductive 1k epoxy formulationHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 1346US2023386698A1Electrically conductive one component (1k) epoxy formulationHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 1438US10717236B2Curing a heat-curable material in an embedded curing zoneTNO·Filed 2013·Granted Jul 21, 2020·0 cites·13 claims
- 1535US9914855B2Curable compositions comprising composite particlesHENKEL AG & CO KGAA·Filed 2015·Granted Mar 13, 2018·0 cites·17 claims
- 1635US2016035910A1Electrically conductive inksHENKEL AG & CO KGAA·Filed 2015·Application pending·0 cites
- 1734US2017018325A1Sinterable metal particles and the use thereof in electronics applicationsHENKEL AG & CO KGAA·Filed 2016·Application pending·0 cites
- 1832US10524364B2Electrically conductive adhesivesHENCKENS ANJA·Filed 2012·Granted Dec 31, 2019·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →