Inventor · disambiguated record
Michael J. Palmer
Also filed as: PALMER MICHAEL J · PALMER MICHAEL JON
42 granted patents·1,336 citations·filing 1988–1998
98Inventor score
Top patents by PatentIndex Score
42 records- 0197US5244143AApparatus and method for injection molding solder and applications thereofIBM·Filed 1992·Granted Sep 14, 1993·297 cites·35 claims
- 0297US5134460AAluminum bump, reworkable bump, and titanium nitride structure for tab bondingIBM·Filed 1990·Granted Jul 28, 1992·265 cites·15 claims
- 0390US4862322ADouble electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetweenBICKFORD HARRY R·Filed 1988·Granted Aug 29, 1989·116 cites·12 claims
- 0489US4875614AAlignment deviceIBM·Filed 1988·Granted Oct 24, 1989·90 cites·28 claims
- 0577US4939570AHigh power, pluggable tape automated bonding packageIBM·Filed 1988·Granted Jul 3, 1990·49 cites·9 claims
- 0674US5186632AElectronic device elastomeric mounting and interconnection technologyIBM·Filed 1991·Granted Feb 16, 1993·36 cites·15 claims
- 0771US4937006AMethod and apparatus for fluxless solder bondingIBM·Filed 1988·Granted Jun 26, 1990·43 cites·22 claims
- 0869US4832255APrecision solder transfer method and meansIBM·Filed 1988·Granted May 23, 1989·34 cites·9 claims
- 0967US5948286ADiffusion bonding of lead interconnections using precise laser-thermosonic energyIBM·Filed 1997·Granted Sep 7, 1999·34 cites·3 claims
- 1065US5135155AThermocompression bonding in integrated circuit packagingIBM·Filed 1991·Granted Aug 4, 1992·34 cites·16 claims
- 1163US5117275AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1990·Granted May 26, 1992·28 cites·12 claims
- 1261US5263620AWirebond removal apparatus using alternating fluid streamIBM·Filed 1992·Granted Nov 23, 1993·30 cites·20 claims
- 1361US5006925AThree dimensional microelectric packagingIBM·Filed 1989·Granted Apr 9, 1991·25 cites·9 claims
- 1460US5006917AThermocompression bonding in integrated circuit packagingIBM·Filed 1989·Granted Apr 9, 1991·25 cites·10 claims
- 1559US5546655AMethod of applying flex tape protective coating onto a flex productIBM·Filed 1994·Granted Aug 20, 1996·21 cites·25 claims
- 1656US5052606ATape automated bonding feederIBM·Filed 1990·Granted Oct 1, 1991·27 cites·16 claims
- 1748US5360946AFlex tape protective coatingIBM·Filed 1991·Granted Nov 1, 1994·13 cites·16 claims
- 1848US5229328AMethod for bonding dielectric mounted conductors to semiconductor chip contact padsIBM·Filed 1992·Granted Jul 20, 1993·17 cites·20 claims
- 1947US5669437AHigh efficiency thermal interposerIBM·Filed 1993·Granted Sep 23, 1997·9 cites·18 claims
- 2046US5734196AElectronic packaging shaped beam lead fabricationIBM·Filed 1995·Granted Mar 31, 1998·12 cites·6 claims
- 2145US5205461AMethod and apparatus for fluxless solder bondingIBM·Filed 1990·Granted Apr 27, 1993·16 cites·12 claims
- 2244US5847926ALightweight packagingIBM·Filed 1996·Granted Dec 8, 1998·11 cites·15 claims
- 2344US5446261ASolder application system using helix to control solder meniscusIBM·Filed 1993·Granted Aug 29, 1995·9 cites·13 claims
- 2442US5242569AThermocompression bonding in integrated circuit packagingIBM·Filed 1991·Granted Sep 7, 1993·12 cites·4 claims
- 2542US5233221AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1991·Granted Aug 3, 1993·11 cites·17 claims
- 2641US5641114AControlled temperature bondingIBM·Filed 1995·Granted Jun 24, 1997·8 cites·12 claims
- 2739US5676301ACastellated nozzle and method of use thereofIBM·Filed 1996·Granted Oct 14, 1997·8 cites·21 claims
- 2839US5675884AApparatus for multilayer conductor chip packagingIBM·Filed 1995·Granted Oct 14, 1997·6 cites·6 claims
- 2938US6403892B1Coated means for connecting a chip and a cardIBM·Filed 1996·Granted Jun 11, 2002·6 cites·9 claims
- 3038US5768770AElectronic packaging shaped beam lead fabricationFiled 1995·Granted Jun 23, 1998·5 cites·10 claims
- 3137US6734363B1Lightweight electronic equipment conductor with coolant permeable supportIBM·Filed 1998·Granted May 11, 2004·6 cites·11 claims
- 3237US5074969AComposition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrateIBM·Filed 1991·Granted Dec 24, 1991·8 cites·8 claims
- 3336US5503698ABonding method employing organometallic interconnectorsIBM·Filed 1991·Granted Apr 2, 1996·5 cites·5 claims
- 3435US5915462AHigh efficiency thermal interposerIBM·Filed 1997·Granted Jun 29, 1999·5 cites·2 claims
- 3533US5148261AThermocompression bonding in integrated circuit packagingIBM·Filed 1991·Granted Sep 15, 1992·5 cites·10 claims
- 3632US5132351AChemical solder comprising a metal salt, polyphthalaldehyde and a solventIBM·Filed 1991·Granted Jul 21, 1992·3 cites·4 claims
- 3732US5038195AComposition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrateIBM·Filed 1990·Granted Aug 6, 1991·4 cites·49 claims
- 3831US5120418ALead frame plating apparatus for thermocompression bondingIBM·Filed 1991·Granted Jun 9, 1992·3 cites·2 claims
- 3930US6295128B1Optical alignment of superpositioned objectsIBM·Filed 1995·Granted Sep 25, 2001·0 cites·7 claims
- 4030US5687078AFine pitch bondingIBM·Filed 1995·Granted Nov 11, 1997·0 cites·10 claims
- 4130US5322204AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1993·Granted Jun 21, 1994·0 cites·5 claims
- 4227US5593083ACastellated nozzle and method of use therofIBM·Filed 1995·Granted Jan 14, 1997·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →