Inventor · disambiguated record
Chi-Kwan Lau
Also filed as: LAU CHI K · LAU CHI KWAN
5 granted patents·1 pending application·138 citations·filing 1983–2020
83Inventor score
Top patents by PatentIndex Score
6 records- 0188US4545116AMethod of forming a titanium disilicideTEXAS INSTRUMENTS INC·Filed 1983·Granted Oct 8, 1985·60 cites·8 claims
- 0275US4587718AProcess for forming TiSi2 layers of differing thicknesses in a single integrated circuitTEXAS INSTRUMENTS INC·Filed 1984·Granted May 13, 1986·32 cites·18 claims
- 0373US6284606B1Process to achieve uniform groove depth in a silicon substrateCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Sep 4, 2001·20 cites·13 claims
- 0444US5476800AMethod for formation of a buried layer for a semiconductor deviceFiled 1994·Granted Dec 19, 1995·16 cites·6 claims
- 0538US5158900AMethod of separately fabricating a base/emitter structure of a BiCMOS deviceHEWLETT PACKARD CO·Filed 1991·Granted Oct 27, 1992·10 cites·14 claims
- 0634US2020228772A1Media playerLAU CHI KWAN·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →